Datasheet

Table Of Contents
MCP6271/1R/2/3/4/5
DS21810F-page 20 © 2008 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
8-Lead MSOP Example:
XXXXXX
YWWNNN
6271E
644256
5-Lead SOT-23 (MCP6271 and MCP6271R)
Example:
XXNN CG25
Device Code
MCP6271 CGNN
MCP6271R ETNN
Note: Applies to 5-Lead SOT-23
6-Lead SOT-23 (MCP6273)
Example:
XXNN CK25
MCP6271
E/P^^256
0644
MCP6271
E/P256
0437
OR
MCP6271
E/SN0437
256
MCP6271E
SN^^0644
256
OR
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e