Datasheet

© 2008 Microchip Technology Inc. DS21882D-page 33
MCP6241/1R/1U/2/4
APPENDIX A: REVISION HISTORY
Revision D (October 2008)
The following is the list of modifications:
1. Changed Heading “Available Tools” to “Design
Aids”.
2. Design Aids: Name change for Mindi Simulator
Tool.
3. Package Types: Added DFN to MCP6231
Device.
4. Absolute Maximum Ratings: Numerous
changes in this section.
5. Updated notes to Section 1.0 “Electrical Char-
acteristics”.
6. Added Figure 2-19.
7. Numerous changes to Section 3.0 “Pin
Descriptions”.
8. Added Section 4.1.1 “Phase Reversal”,
Section 4.1.2 “Input Voltage and Current
Limits”, and Section 4.1.3 “Normal Opera-
tion”.
9. Replaced Section 5.0 “Design Aids” with
additional information.
10. Added 2x3 DFN package to Section 6.0 “Pack-
aging Information” and updated Package Out-
line Drawings.
11. Added 2x3 DFN package to Product Identifica-
tion System section.
Revision C (March 2005)
The following is the list of modifications:
1. Added the MCP6244 quad op amp.
2. Re-compensated parts. Specifications that
change are: Gain Bandwidth Product (BWP)
and Phase Margin (PM) in AC Electrical
Characteristics table.
3. Corrected plots in Section 2.0 “Typical Perfor-
mance Curves”.
4. Added Section 3.0 “Pin Descriptions”.
5. Added new SC-70 package markings. Added
PDIP-14, SOIC-14, and TSSOP-14 packages
and corrected package marking information
(Section 6.0 “Packaging Information”).
6. Added Appendix A: “Revision History”.
Revision B (August 2004)
Undocumented changes.
Revision A (March 2004)
Original Release of this Document.