Datasheet

MCP621/1S/2/3/4/5/9
DS22188C-page 6 © 2009-2011 Microchip Technology Inc.
1.3 Timing Diagram
FIGURE 1-1: Timing Diagram.
TABLE 1-4: TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, all limits are specified for: V
DD
= +2.5V to +5.5V,V
SS
= GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
-40 — +125 °C
Operating Temperature Range T
A
-40 — +125 °C (Note 1)
Storage Temperature Range T
A
-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23 θ
JA
— 220.7 — °C/W
Thermal Resistance, 6L-SOT-23 θ
JA
— 190.5 — °C/W
Thermal Resistance, 8L-2x3 TDFN θ
JA
—52.5—°C/W
Thermal Resistance, 8L-3x3 DFN θ
JA
—56.7—°C/W(Note 2)
Thermal Resistance, 8L-SOIC θ
JA
— 149.5 — °C/W
Thermal Resistance, 10L-3x3 DFN θ
JA
—53.3—°C/W(Note 2)
Thermal Resistance, 10L-MSOP θ
JA
—202—°C/W
Thermal Resistance, 14L-SOIC θ
JA
—95.3—°C/W
Thermal Resistance, 14L-TSSOP θ
JA
—100—°C/W
Thermal Resistance, 16L-4x4-QFN θ
JA
—45.7—°C/W(Note 2)
Note 1: Operation must not cause T
J
to exceed the Maximum Junction Temperature specification (150°C).
2: Measured on a standard JC51-7, four layer printed circuit board with ground plane and vias.
High-Z
V
DD
V
OUT
-3 µA (typical)
High-Z
I
SS
I
CS
-3 µA (typical)
-2.5 mA (typical)
V
PRH
V
PRL
t
PON
t
POFF
On
0nA(typical)
High-Z
-3 µA (typical)
-2.5 mA (typical)
t
COFF
t
CON
On
0.7 µA (typical)
0nA(typical)
CAL/CS
V
IH
V
IL
t
CSU
Note: For the MCP625 dual and the MCP629 quad, there is an additional constraint on toggling the two
CAL/CS
pins close together; see the T
CON
specification in Table 1-3.