Datasheet

© 2009 Microchip Technology Inc. DS21881E-page 35
MCP6231/2/4
APPENDIX A: REVISION HISTORY
Revision E (August 2009)
The following is the list of modifications:
1. Added the 2x3 TDFN package for MCP6232.
2. Updated the 2x3 DFN package information for
MCP6231.
3. Updated the “Temperature Characteristics”
table.
4. Updated Section 3.0 “Pin Descriptions”.
5. Updated the Package Outline Drawings in
Section 6.0 “Packaging Information”.
6. Updated the Product Identification Systems
section.
Revision D (May 2008)
The following is the list of modifications:
1. Changed Heading “Available Tools” to “Design
Aids”.
2. Design Aids: Name change for Mindi Simulator
Tool.
3. Package Types: Added DFN to MCP6231
Device.
4. Absolute Maximum Ratings: Numerous
changes in this section.
5. Updated notes to Section 1.0 “Electrical
Characteristics”.
6. Added Test Circuits to Section 1.0 “Electrical
Characteristics”.
7. Corrected Figure 2-7.
8. Added Figure 2-19.
9. Numerous changes to Section 3.0 “Pin
Descriptions”.
10. Added Section 4.1.1 “Phase Reversal”,
Section 4.1.2 “Input Voltage and Current
Limits”, and Section 4.1.3 “Normal
Operation”.
11. Replaced Section 5.0 “Design Aids” with
additional information.
12. Updated Section 6.0 “Packaging
Information” with updated Package Outline
Drawings.
Revision C (March 2005)
The following is the list of modifications:
1. Added the MCP6234 quad op amp.
2. Corrected plots in Section 2.0 “Typical
Performance Curves”.
3. Added Section 3.0 “Pin Descriptions”.
4. Added new SC-70 package markings. Added
PDIP-14, SOIC-14, and TSSOP-14 packages
and corrected package marking information
(Section 6.0 “Packaging Information”).
5. Added Appendix A: “Revision History”.
Revision B (August 2004)
• Undocumented changes.
Revision A (March 2004)
• Original Release of this Document.