Datasheet

MCP621/1S/2/3/4/5/9
DS22188C-page 2 © 2009-2011 Microchip Technology Inc.
Package Types
MCP621
SOIC
MCP622
SOIC
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
V
CAL
CAL/CSNC
V
INA
+
V
INA
–
V
SS
1
2
3
4
8
7
6
5
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
MCP625
MSOP
V
INA
+
V
INA
–
V
SS
1
2
3
4
10
9
8
7
V
OUTA
V
DD
V
OUTB
V
INB
–
V
INB
+
CAL
A/CSA
5 6
CALB/CSB
MCP622
3x3 DFN *
MCP625
3x3 DFN *
* Includes Exposed Thermal Pad (EP); see Tabl e 3- 1 .
V
INA
+
V
INA
–
V
SS
V
OUTB
V
INB
–
1
2
3
4
8
7
6
5
V
INB
+
V
DD
V
OUTA
EP
9
V
SS
V
INA
+
CAL
A/CSA
V
INB
–
V
INB
+
2
3
4
5
9
8
7
6
CALB/CSB
V
OUTB
V
INA
–
EP
11
1 10
V
DD
V
OUTA
2
MCP629
4x4 QFN*
V
DD
V
INB
+
V
INA
-V
IND
+
V
SS
V
INB
-
V
INC
+
V
OUTB
CALBC/CSBC
V
OUTC
V
INC
-
V
OUTA
CALAD/CSAD V
OUTD
V
IND
-
V
INA
+
EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
MCP624
SOIC, TSSOP
V
INA
+
V
INA
-
V
DD
1
2
3
4
14
13
12
11
V
OUTA
V
OUTD
V
IND
-
V
IND
+
V
SS
V
INB
+
5
10
V
INC
+
V
INB
-
6
9
V
OUTB
7 8
V
OUTC
V
INC
-
MCP621
2x3 TDFN *
V
IN
+
V
IN
–
V
SS
V
DD
V
OUT
1
2
3
4
8
7
6
5
V
CAL
CAL/CSNC
EP
9
CAL/CS
V
IN
+
V
OUT
V
SS
V
IN
-
MCP623
SOT-23-6
V
DD
1
2
3
4
5
6
V
IN
+
V
OUT
V
SS
V
IN
-
MCP621S
SOT-23-5
V
DD
1
2
3
4
5