Datasheet
© 2009 Microchip Technology Inc. DS21668D-page 23
MCP6141/2/3/4
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
8-Lead MSOP
Example:
XXXXXX
YWWNNN
6143I
918256
5-Lead SOT-23 (MCP6141)
Example:
XXNN AS25
Device E-Temp Code
MCP6141 ASNN
Note: Applies to 5-Lead SOT-23
6-Lead SOT-23 (MCP6143)
Example:
XXNN AW25
Device E-Temp Code
MCP6143 AWNN
Note: Applies to 6-Lead SOT-23
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example
:
XXXXXXXX
XXXXYYWW
NNN
MCP6141
I/P256
0918
MCP6142
I/SN0918
256
MCP6141
E/P 256
0918
MCP6142E
SN 0918
256
3
e
OR
OR
3
e