Datasheet

© 2010 Microchip Technology Inc. DS22142B-page 13
MCP6071/2/4
3.0 PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Analog Outputs
The output pins are low-impedance voltage sources.
3.2 Analog Inputs
The non-inverting and inverting inputs are high-
impedance CMOS inputs with low bias currents.
3.3 Power Supply Pins
The positive power supply (V
DD
) is 1.8V to 6.0V higher
than the negative power supply (V
SS
). For normal
operation, the other pins are at voltages between V
SS
and V
DD
.
Typically, these parts are used in a single (positive)
supply configuration. In this case, V
SS
is connected to
ground and V
DD
is connected to the supply. V
DD
will
need bypass capacitors.
3.4 Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the V
SS
pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
MCP6071 MCP6072 MCP6074
Symbol Description
SOIC SOT-23-5 2x3 TDFN SOIC 2x3 TDFN
SOIC,
TSSOP
61 611 1V
OUT
, V
OUTA
Analog Output (op amp A)
24 222 2V
IN
–, V
INA
Inverting Input (op amp A)
33 333 3V
IN
+, V
INA
+ Non-inverting Input (op amp A)
75 788 4 V
DD
Positive Power Supply
—— 5 5 5 V
INB
+ Non-inverting Input (op amp B)
—— 6 6 6
V
INB
Inverting Input (op amp B)
—— 7 7 7 V
OUTB
Analog Output (op amp B)
—— —— 8 V
OUTC
Analog Output (op amp C)
—— —— 9 V
INC
Inverting Input (op amp C)
—— —— 10 V
INC
+ Non-inverting Input (op amp C)
42 444 11 V
SS
Negative Power Supply
—— —— 12 V
IND
+ Non-inverting Input (op amp D)
—— —— 13 V
IND
Inverting Input (op amp D)
—— —— 14 V
OUTD
Analog Output (op amp D)
1, 5, 8 1, 5, 8 NC No Internal Connection
9 9 EP Exposed Thermal Pad (EP); must
be connected to V
SS
.