MCP6071/2/4 110 µA, High Precision Op Amps Description Features • • • • • • • • Low Offset Voltage: ±150 µV (maximum) Low Quiescent Current: 110 µA (typical) Rail-to-Rail Input and Output Wide Supply Voltage Range: 1.8V to 6.0V Gain Bandwidth Product: 1.2 MHz (typical) Unity Gain Stable Extended Temperature Range: -40°C to +125°C No Phase Reversal Applications • • • • • • • The Microchip Technology Inc.
MCP6071/2/4 NOTES: DS22142B-page 2 © 2010 Microchip Technology Inc.
MCP6071/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † Current at Output and Supply Pins ............................±30 mA † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied.
MCP6071/2/4 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +6.0V, VSS= GND, TA= +25°C, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2 and RL = 10 kΩ to VL. (Refer to Figure 1-1). Parameters Sym Min Typ Max Units Conditions AOL 95 115 — dB 0.2V < VOUT <(VDD-0.2V) VCM = VSS VOL, VOH VSS+15 — VDD–15 mV 0.
MCP6071/2/4 1.3 Test Circuits The circuit used for most DC and AC tests is shown in Figure 1-1. This circuit can independently set VCM and VOUT; see Equation 1-1. Note that VCM is not the circuit’s common mode voltage ((VP + VM)/2), and that VOST includes VOS plus the effects (on the input offset error, VOST) of temperature, CMRR, PSRR and AOL. CF 6.
MCP6071/2/4 NOTES: DS22142B-page 6 © 2010 Microchip Technology Inc.
MCP6071/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6071/2/4 5 Output Voltage (V) TA = -40°C TA = +25°C TA = +85°C TA = +125°C PSRR- 100 CMRR, PSRR (dB) Representative Part 6.5 Representative Part 90 CMRR 80 70 PSRR+ 60 50 40 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 30 FIGURE 2-8: Input Offset Voltage vs. Power Supply Voltage. 20 10 10 PSRR, CMRR (dB) 100 0.1 1.E-1 1 1.E+0 FIGURE 2-9: vs. Frequency. DS22142B-page 8 10 1.E+1 100 1.E+2 1k 1.E+3 10k 1.E+4100k 1.
MCP6071/2/4 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 150 140 Quiescent Current (µA/Amplifier) VCMR_H - VDD @ VDD = 6.0V @ VDD = 3.0V @ VDD = 1.8V VCMR_L - VSS @ VDD = 1.8V VOL - VSS @ VDD = 3.0V VOL - VSS @ VDD = 6.0V 120 110 100 90 80 60 -50 125 120 100 80 60 40 120 100 TA = +85°C 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Common Mode Input Votlage (V) FIGURE 2-15: Input Bias Current vs. Common Mode Input Voltage.
MCP6071/2/4 RL = 10 kΩ VSS + 0.2V < VOUT < VDD - 0.2V 5.5 DC-Open-Loop Gain (dB) 0.6 0.4 0.2 6.0 VDD = 6.0V Phase Margin 0 FIGURE 2-22: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage. 1.8 VDD = 6.0V VDD = 1.8V Large Signal AOL 0.05 0.10 0.15 0.20 0.25 180 1.6 Gain Bandwidth Product 140 1.2 120 1.0 100 0.8 80 0.6 60 0.4 VDD = 6.0V Phase Margin 0.2 -50 -25 0 25 50 75 100 Ambient Temperature (°C) 120 110 100 Input Referred 80 100 1k 10k 100k 1M 1.
MCP6071/2/4 16.0 35 Output Voltage Headroom VDD - VOH or VOL - VSS (mV) 40 TA = -40°C TA = +25°C TA = +85°C TA = +125°C 30 25 20 15 10 5 14.0 10.0 8.0 6.0 2.0 0.0 -50 VDD = 6.0V VDD = 1.8V 1 0.1 1k 1000 10k 10000 100k 100000 1M 1000000 (VDD - VOH)/IOUT VDD = 1.8V (VOL - VSS )/(-IOUT) (VDD - VOH )/IOUT (VOL - VSS )/(-IOUT) VDD = 6.0V 0.1 1 Output Current (mA) © 2010 Microchip Technology Inc. 125 Rising Edge, VDD = 6.0V Rising Edge, VDD = 1.8V -25 FIGURE 2-29: Temperature.
MCP6071/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. VDD = 6.0V G = -1 V/V 6.0 VIN 4.0 3.0 2.0 1.0 VDD = 6.0V G = +2 V/V 0.0 -1.0 Time (2 µs/div) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Small Signal Inverting Pulse Time (0.1 ms/div) FIGURE 2-34: The MCP6071/2/4 Shows No Phase Reversal. 1000 VDD = 6.0V G = +1 V/V Closed Loop Output Impedance (Ω) FIGURE 2-31: Response.
MCP6071/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
MCP6071/2/4 NOTES: DS22142B-page 14 © 2010 Microchip Technology Inc.
MCP6071/2/4 4.0 APPLICATION INFORMATION The MCP6071/2/4 family of op amps is manufactured using Microchip’s state-of-the-art CMOS process and is specifically designed for low-power, high precision applications. 4.1 VDD D1 U1 D2 V1 MCP607X Rail-to-Rail Input VOUT V2 4.1.1 PHASE REVERSAL The MCP6071/2/4 op amps are designed to prevent phase reversal when the input pins exceed the supply voltages. Figure 2-34 shows the input voltage exceeding the supply voltage without any phase reversal. 4.1.
MCP6071/2/4 4.2 Rail-to-Rail Output The output voltage range of the MCP6071/2/4 op amps is VSS + 15 mV (minimum) and VDD – 15 mV (maximum) when RL = 10 kΩ is connected to VDD/2 and VDD = 6.0V. Refer to Figures 2-27 and 2-28 for more information. 4.3 4.4 Capacitive Loads Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced.
MCP6071/2/4 4.6 PCB Surface Leakage In applications where low input bias current is critical, Printed Circuit Board (PCB) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012Ω. A 5V difference would cause 5 pA of current to flow; which is greater than the MCP6071/2/4 family’s bias current at +25°C (±1.0 pA, typical).
MCP6071/2/4 4.7 Application Circuits 4.7.1 4.7.2 GYRATOR The MCP6071/2/4 op amps can be used in gyrator applications. The gyrator is an electric circuit which can make a capacitive circuit behave inductively. Figure 4-8 shows an example of a gyrator simulating inductance, with an approximately equivalent circuit below. The two ZIN have similar values in typical applications.
MCP6071/2/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6071/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6071/2/4 op amps is available on the Microchip web site at www.microchip.com. The model was written and tested in official Orcad (Cadence) owned PSPICE. For the other simulators, it may require translation. The model covers a wide aspect of the op amp's electrical specifications.
MCP6071/2/4 NOTES: DS22142B-page 20 © 2010 Microchip Technology Inc.
MCP6071/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SOT-23 (MCP6071) YH25 XXNN 8-Lead SOIC (150 mil) (MCP6071, MCP6072) 8-Lead 2x3 TDFN (MCP6071, MCP6072) Legend: XX...
MCP6071/2/4 Package Marking Information (Continuation) 14-Lead SOIC (150 mil) (MCP6074) Example: MCP6074 E/SL e3 1044256 XXXXXXXXXXX XXXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6074) XXXXXXXX YYWW NNN DS22142B-page 22 Example: MCP6074E 1044 256 © 2010 Microchip Technology Inc.
MCP6071/2/4 .
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22142B-page 24 © 2010 Microchip Technology Inc.
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22142B-page 26 © 2010 Microchip Technology Inc.
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22142B-page 28 © 2010 Microchip Technology Inc.
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MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22142B-page 32 © 2010 Microchip Technology Inc.
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6071/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22142B-page 34 © 2010 Microchip Technology Inc.
MCP6071/2/4 APPENDIX A: REVISION HISTORY Revision B (December 2010) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. Added new SOT-23-5 package type for MCP6071 device. Corrected Figures 2-13, 2-22, 2-23, 2-24, 2-28, 2-29 and 2-34 in Section 2.0 “Typical Performance Curves”. Modified Table 3-1 to show the pin column for MCP6071, SOT-23-5 package. Updated Section 4.1.2 “Input Voltage Limits”. Added Section 4.1.3 “Input Current Limits”. Added new document item in Section 5.
MCP6071/2/4 NOTES: DS22142B-page 36 © 2010 Microchip Technology Inc.
MCP6071/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6071/2/4 NOTES: DS22142B-page 38 © 2010 Microchip Technology Inc.
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