MCP6061/2/4 60 µA, High Precision Op Amps Features • • • • • • • • Description Low Offset Voltage: ±150 µV (maximum) Low Quiescent Current: 60 µA (typical) Rail-to-Rail Input and Output Wide Supply Voltage Range: 1.8V to 6.0V Gain Bandwidth Product: 730 kHz (typical) Unity Gain Stable Extended Temperature Range: -40°C to +125°C No Phase Reversal Applications • • • • • • • The MCP6061/2/4 family is offered in single (MCP6061), dual (MCP6062), and quad (MCP6064) configurations.
MCP6061/2/4 NOTES: DS22189B-page 2 © 2010 Microchip Technology Inc.
MCP6061/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VDD – VSS ...............................
MCP6061/2/4 DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +6.0V, VSS= GND, TA= +25°C, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2 and RL = 10 kΩ to VL. (Refer to Figure 1-1). Parameters Sym Min Typ Max Units Conditions AOL 95 115 — dB 0.2V < VOUT <(VDD-0.2V) VCM = VSS VOL, VOH VSS+15 — VDD–15 mV 0.5V input overdrive ISC — ±6 — mA VDD = 1.8V — ±27 — mA VDD = 6.
MCP6061/2/4 1.3 Test Circuits The circuit used for most DC and AC tests is shown in Figure 1-1. This circuit can independently set VCM and VOUT; see Equation 1-1. Note that VCM is not the circuit’s common mode voltage ((VP + VM)/2), and that VOST includes VOS plus the effects (on the input offset error, VOST) of temperature, CMRR, PSRR and AOL. CF 6.
MCP6061/2/4 NOTES: DS22189B-page 6 © 2010 Microchip Technology Inc.
MCP6061/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6061/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. 6.5 6.0 5.5 FIGURE 2-10: Input Noise Voltage Density vs. Common Mode Input Voltage. 110 Representative Part PSRR- CMRR, PSRR (dB) 100 Representative Part 90 CMRR 80 70 PSRR+ 60 50 40 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 30 20 10 Power Supply Voltage (V) FIGURE 2-8: Input Offset Voltage vs. Power Supply Voltage.
MCP6061/2/4 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 Quiescent Current (uA/Amplifier) VCMR_H - VOH @ VDD = 6.0V @ VDD = 3.0V @ VDD = 1.8V VCMR_L - VSS @ VDD = 1.8V VOL - VSS @ VDD = 3.0V VOL - VSS @ VDD = 6.0V -50 -25 0 25 50 75 100 Ambient Temperature (°C) Quiescent Current (uA) Input Bias Current 100 10 Input Offset Current 0 25 50 75 100 Ambient Temperature (°C) 125 80 VDD = 6.0V VCM = 0.
MCP6061/2/4 1.2 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Power Supply Voltage (V) 5.5 Gain Bandwidth Product (MHz) DC-Open Loop Gain (dB) VDD = 6.0V VDD = 1.8V Large Signal A OL 60 0.5 VDD = 6.0V 0.05 0.10 0.15 0.20 Output Voltage Headroom (V) 120 110 100 Input Referred 20 0.3 0 1.2 180 1.1 160 1.0 1k 1.0E+03 1.0E+05 10k 100k Frequency (Hz) 1.0E+04 1.0E+06 1M Frequency (Hz) FIGURE 2-21: Channel-to-Channel Separation vs. Frequency (MCP6062/4 only).
MCP6061/2/4 35 Output Voltage Headroom (mV) 40 TA = -40°C TA = +25°C TA = +85°C TA = +125°C 30 25 20 15 10 5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.0 Output Short Circuit Current (mA) Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. 16 14 VDD - VOH 12 10 8 6 VOL - VSS 4 2 0 -50 -25 Power Supply Voltage (V) FIGURE 2-25: Output Short Circuit Current vs.
MCP6061/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. VDD = 6.0V G = -1 V/V 6.0 4.0 3.0 2.0 1.0 VDD = 6.0V G = +2 V/V -1.0 FIGURE 2-32: Pulse Response. 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 FIGURE 2-33: Response. DS22189B-page 12 FIGURE 2-34: The MCP6061/2/4 Shows No Phase Reversal. 1000 V DD = 6.0V G = +1 V/V Closed Loop Output Impedance (Ω) 6.0 5.5 5.0 4.5 4.0 3.5 3.
MCP6061/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
MCP6061/2/4 NOTES: DS22189B-page 14 © 2010 Microchip Technology Inc.
MCP6061/2/4 4.0 APPLICATION INFORMATION The MCP6061/2/4 family of op amps is manufactured using Microchip’s state-of-the-art CMOS process and is specifically designed for low-power, high precision applications. 4.1 D1 U1 D2 V1 MCP606X Rail-to-Rail Input 4.1.1 VDD VOUT V2 PHASE REVERSAL The MCP6061/2/4 op amps are designed to prevent phase reversal when the input pins exceed the supply voltages. Figure 2-34 shows the input voltage exceeding the supply voltage without any phase reversal.
MCP6061/2/4 4.2 Rail-to-Rail Output The output voltage range of the MCP6061/2/4 op amps is VSS + 15 mV (minimum) and VDD – 15 mV (maximum) when RL = 10 kΩ is connected to VDD/2 and VDD = 6.0V. Refer to Figures 2-27 and 2-28 for more information. 4.3 4.4 Capacitive Loads Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced.
MCP6061/2/4 4.6 PCB Surface Leakage In applications where low input bias current is critical, Printed Circuit Board (PCB) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012Ω. A 5V difference would cause 5 pA of current to flow; which is greater than the MCP6061/2/4 family’s bias current at +25°C (±1.0 pA, typical).
MCP6061/2/4 4.7 Application Circuits 4.7.1 4.7.2 GYRATOR The MCP6061/2/4 op amps can be used in gyrator applications. The gyrator is an electric circuit which can make a capacitive circuit behave inductively. Figure 4-8 shows an example of a gyrator simulating inductance, with an approximately equivalent circuit below. The two ZIN have similar values in typical applications.
MCP6061/2/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6061/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6061/2/4 op amps is available on the Microchip web site at www.microchip.com. The model was written and tested in official Orcad (Cadence) owned PSPICE. For the other simulators, it may require translation. The model covers a wide aspect of the op amp's electrical specifications.
MCP6061/2/4 NOTES: DS22189B-page 20 © 2010 Microchip Technology Inc.
MCP6061/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SOT-23 (MCP6061) YG25 XXNN 8-Lead SOIC (150 mil) (MCP6061, MCP6062) 8-Lead 2x3 TDFN (MCP6061, MCP6062) XXX YWW NN Example: MCP6061E e3 1044 SN^^ 256 XXXXXXXX XXXXYYWW NNN Example: AHC 044 25 Legend: XX...
MCP6061/2/4 Package Marking Information (Continuation) 14-Lead SOIC (150 mil) (MCP6064) Example: MCP6064 e3 E/SL^^ 1044256 XXXXXXXXXXX XXXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6064) XXXXXXXX YYWW NNN DS22189B-page 22 Example: MCP6064E 1044 256 © 2010 Microchip Technology Inc.
MCP6061/2/4 .
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22189B-page 24 © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22189B-page 26 © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22189B-page 28 © 2010 Microchip Technology Inc.
MCP6061/2/4 ! " # $ % & ' '()* + , ! . # # $ # / ## +22--- 2 © 2010 Microchip Technology Inc.
MCP6061/2/4 -. & /" )0( + , 12 .
MCP6061/2/4 . # # $ # / ## +22--- 2 © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22189B-page 32 © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6061/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22189B-page 34 © 2010 Microchip Technology Inc.
MCP6061/2/4 APPENDIX A: REVISION HISTORY Revision B (December 2010) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. 8. Added new SOT-23-5 package type for MCP6061 device. Corrected Figures 2-13, 2-22, 2-23, 2-24 and 2-28 in Section 2.0 “Typical Performance Curves”. Modified Table 3-1 to show the pin column for MCP6061, SOT-23-5 package. Updated Section 4.1.2 “Input Voltage Limits”. Added Section 4.1.3 “Input Current Limits”. Added new document item in Section 5.5 “Application Notes”.
MCP6061/2/4 NOTES: DS22189B-page 36 © 2010 Microchip Technology Inc.
MCP6061/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6061/2/4 NOTES: DS22189B-page 38 © 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.