MCP6051/2/4 30 µA, High Precision Op Amps Features • • • • • • • • Description Low Offset Voltage: ±150 µV (maximum) Low Quiescent Current: 30 µA (typical) Rail-to-Rail Input and Output Wide Supply Voltage Range: 1.8V to 6.0V Gain Bandwidth Product: 385 kHz (typical) Unity Gain Stable Extended Temperature Range: -40°C to +125°C No Phase Reversal Applications • • • • • • • The Microchip Technology Inc.
MCP6051/2/4 NOTES: DS22182B-page 2 © 2010 Microchip Technology Inc.
MCP6051/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings † Current at Output and Supply Pins ............................±30 mA † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied.
MCP6051/2/4 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +6.0V, VSS= GND, TA= +25°C, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2 and RL = 100 kΩ to VL. (Refer to Figure 1-1). Parameters Sym Min Typ Max Units Conditions AOL 95 115 — dB 0.2V < VOUT <(VDD-0.2V) VCM = VSS VOL, VOH VSS+15 — VDD–15 mV RL = 10 kΩ, 0.
MCP6051/2/4 1.3 Test Circuits The circuit used for most DC and AC tests is shown in Figure 1-1. This circuit can independently set VCM and VOUT; see Equation 1-1. Note that VCM is not the circuit’s common mode voltage ((VP + VM)/2), and that VOST includes VOS plus the effects (on the input offset error, VOST) of temperature, CMRR, PSRR and AOL. CF 6.
MCP6051/2/4 NOTES: DS22182B-page 6 © 2010 Microchip Technology Inc.
MCP6051/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 27% 6.5 6.0 5.5 5.0 4.0 3.5 3.
MCP6051/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF. Output Voltage (V) 750 600 450 300 150 0 -150 -300 -450 -600 -750 6.5 6.0 5.5 5.0 4.5 FIGURE 2-10: Input Noise Voltage Density vs. Common Mode Input Voltage. 110 PSRR- 100 CMRR, PSRR (dB) Representative Part Representative Part 90 80 CMRR 70 60 PSRR+ 50 40 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.
MCP6051/2/4 45 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 VCMR_H - VDD @ VDD = 6.0V @ VDD = 3.0V @ VDD = 1.8V VCMR_L - VSS @ VDD = 1.8V VOL - VSS @ V DD = 3.0V VOL - VSS @ VDD = 6.0V 0 25 50 75 100 Ambient Temperature (°C) 25 VDD = 1.8V VCM = 0.9VDD 20 125 -50 45 Quiescent Current (uA) VDD = 6.
MCP6051/2/4 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Power Supply Voltage (V) 5.5 DC-Open Loop Gain (dB) 150 145 VDD = 6.0V 140 135 130 125 120 V DD = 1.8V 115 110 Large Signal AOL 105 100 0.00 0.05 0.10 0.15 0.20 0.25 Output Voltage Headroom VDD - VOH or VOL - VSS (V) 120 110 100 Input Referred 80 100 100 1k 1000 10k 100k 10000 100000 Frequency (Hz) 1M 1000000 FIGURE 2-21: Channel-to-Channel Separation vs. Frequency (MCP6052/4 only). DS22182B-page 10 100 0.4 80 0.3 60 0.2 VDD = 6.
MCP6051/2/4 35 T A = -40°C T A = +25°C T A = +85°C T A = +125°C 30 25 20 15 10 5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Output Voltage Headroom (mV) 40 0.0 Output Short Circuit Current (mA) Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF. 16.0 14.0 10.0 8.0 6.0 2.0 RL = 10 kΩ 0.0 -50 Slew Rate (V/µs) VDD = 1.8V 1 Falling Edge, VDD = 6.0V Falling Edge, VDD = 1.8V 0.
MCP6051/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF. Output Voltage (20mV/div) 7.0 6.0 V IN 4.0 3.0 2.0 1.0 VDD = 6.0V G = +2 V/V 0.0 -1.0 Time (2 µs/div) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Small Signal Inverting Pulse Time (0.1 ms/div) FIGURE 2-34: The MCP6051/2/4 Shows No Phase Reversal. 10000 VDD = 6.
MCP6051/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
MCP6051/2/4 NOTES: DS22182B-page 14 © 2010 Microchip Technology Inc.
MCP6051/2/4 4.0 APPLICATION INFORMATION The MCP6051/2/4 family of op amps is manufactured using Microchip’s state-of-the-art CMOS process and is specifically designed for low-power, high precision applications. 4.1 D1 U1 D2 V1 MCP605X Rail-to-Rail Input 4.1.1 VDD VOUT V2 PHASE REVERSAL The MCP6051/2/4 op amps are designed to prevent phase reversal when the input pins exceed the supply voltages. Figure 2-34 shows the input voltage exceeding the supply voltage without any phase reversal.
MCP6051/2/4 4.2 Rail-to-Rail Output The output voltage range of the MCP6051/2/4 op amps is VSS + 15 mV (minimum) and VDD – 15 mV (maximum) when RL = 10 kΩ is connected to VDD/2 and VDD = 6.0V. Refer to Figures 2-27 and 2-28 for more information. 4.3 4.4 Capacitive Loads Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced.
MCP6051/2/4 4.6 PCB Surface Leakage 4.7 In applications where low input bias current is critical, Printed Circuit Board (PCB) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012Ω. A 5V difference would cause 5 pA of current to flow; which is greater than the MCP6051/2/4 family’s bias current at +25°C (±1.0 pA, typical).
MCP6051/2/4 4.7.2 INSTRUMENTATION AMPLIFIER The MCP6051/2/4 op amps are well suited for conditioning sensor signals in battery-powered applications. Figure 4-9 shows a two op amp instrumentation amplifier, using the MCP6052, that works well for applications requiring rejection of common mode noise at higher gains. The reference voltage (VREF) is supplied by a low impedance source. In single supply applications, VREF is typically VDD/2.
MCP6051/2/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6051/2/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6051/2/4 op amps is available on the Microchip web site at www.microchip.com. The model was written and tested in official Orcad (Cadence) owned PSPICE. For the other simulators, it may require translation. The model covers a wide aspect of the op amp's electrical specifications.
MCP6051/2/4 NOTES: DS22182B-page 20 © 2010 Microchip Technology Inc.
MCP6051/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SOT-23 (MCP6051) YF25 XXNN 8-Lead SOIC (150 mil) (MCP6051, MCP6052) 8-Lead 2x3 TDFN (MCP6051, MCP6052) XXX YWW NN Example: MCP6051E e3 SN^^1044 256 XXXXXXXX XXXXYYWW NNN Example: AHA 044 25 Legend: XX...
MCP6051/2/4 Package Marking Information (Continuation) 14-Lead SOIC (150 mil) (MCP6054) Example: MCP6054 e3 E/SL^^ 1044256 XXXXXXXXXXX XXXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6054) XXXXXXXX YYWW NNN DS22182B-page 22 Example: MCP6054E 1044 256 © 2010 Microchip Technology Inc.
MCP6051/2/4 .
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22182B-page 24 © 2010 Microchip Technology Inc.
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22182B-page 26 © 2010 Microchip Technology Inc.
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22182B-page 28 © 2010 Microchip Technology Inc.
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MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22182B-page 32 © 2010 Microchip Technology Inc.
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2010 Microchip Technology Inc.
MCP6051/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22182B-page 34 © 2010 Microchip Technology Inc.
MCP6051/2/4 APPENDIX A: REVISION HISTORY Revision B (December 2010) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. 8. Added new SOT-23-5 package type for MCP6051 device. Corrected Figures 2-13, 2-22, 2-23, 2-24 and 2-28 in Section 2.0 “Typical Performance Curves”. Modified Table 3-1 to show the pin column for MCP6051, SOT-23-5 package. Updated Section 4.1.2 “Input Voltage Limits”. Added Section 4.1.3 “Input Current Limits”. Added new document item in Section 5.5 “Application Notes”.
MCP6051/2/4 NOTES: DS22182B-page 36 © 2010 Microchip Technology Inc.
MCP6051/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6051/2/4 NOTES: DS22182B-page 38 © 2010 Microchip Technology Inc.
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