Datasheet

© 2008 Microchip Technology Inc. DS22041B-page 31
MCP6031/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP6031: Single Op Amp
MCP6031T: Single Op Amp (Tape and Reel)
MCP6032: Dual Op Amp
MCP6032T: Dual Op Amp (Tape and Reel)
MCP6033: Single Op Amp with Chip Select
MCP6033T: Single Op Amp with Chip Select
(Tape and Reel)
MCP6034: Quad Op Amp
MCP6034T: Quad Op Amp (Tape and Reel)
Temperature Range: E = -40°C to +125°C
Package: MC = Plastic Dual Flat, No Lead, (2x3 DFN ) 8-lead **
MS = Plastic MSOP, 8-lead
OT = Plastic Small Outline Transistor, 5-lead *
SL = Plastic SOIC (150 mil Body), 14-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
ST = Plastic TSSOP (4.4mm Body), 14-lead
* This package is only available on the MCP6031 device.
** These packages are only available on the MCP6031 and
MCP6033 devices.
PART NO. X /XX
PackageTemperature
Range
Device
Examples:
a) MCP6031-E/SN: 8LD SOIC package.
b) MCP6031T-E/SN: Tape and Reel,
8LD SOIC package.
c) MCP6031-E/MS: 8LD MSOP package.
d) MCP6031T-E/MS: Tape and Reel,
8LD MSOP package.
e) MCP6031-E/MC: 8LD DFN package.
f) MCP6031T-E/MC: Tape and Reel,
8LD DFN package.
g) MCP6031T-E/OT: Tape and Reel,
5-LD SOT-23 package.
a) MCP6032-E/SN: 8LD SOIC package.
b ) M C P 6 0 3 2 T - E / S N : Ta p e a n d R e e l ,
8LD SOIC package.
c) MCP6032-E/MS: 8LD MSOP package
d) MCP6032T-E/MS: Tape and Reel
8LD MSOP package.
a) MCP6033-E/SN: 8LD SOIC package.
b) MCP6033T-E/SN: Tape and Reel,
8LD SOIC package.
c) MCP6033-E/MS: 8LD MSOP package.
d) MCP6033T-E/MS: Tape and Reel,
8LD MSOP package.
e) MCP6033-E/MC: 8LD DFN package.
f) MCP6033T-E/MC: Tape and Reel,
8LD DFN package.
a) MCP6034-E/SL: 14LD SOIC package.
b ) M C P 6 0 3 4 T - E / S L : Ta p e a n d R e e l ,
14LD SOIC package.
c) MCP6034-E/ST: 14LD TSSOP package.
d) MCP6034T-E/ST: Tape and Reel,
14LD TSSOP package.