MCP6031/2/3/4 0.9 µA, High Precision Op Amps Features Description • • • • • • • • The Microchip Technology Inc. MCP6031/2/3/4 family of operational amplifiers (op amps) operate with a single supply voltage as low as 1.8V, while drawing ultra low quiescent current per amplifier (0.9 µA, typical). This family also has low input offset voltage (±150 µV, maximum) and rail-to-rail input and output operation. This combination of features supports battery-powered and portable applications.
MCP6031/2/3/4 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD – VSS ........................................................................7.0V Current at Input Pins .....................................................±2 mA Analog Inputs (VIN+, VIN-)†† .......... VSS – 1.0V to VDD + 1.0V All Other Inputs and Outputs ......... VSS – 0.3V to VDD + 0.3V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
MCP6031/2/3/4 DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS=GND, TA= +25°C, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CS is tied low. (Refer to Figure 1-2 and Figure 1-3). Parameters Sym Min Typ Max Units Conditions — VDD – 10 mV RL = 50 kΩ to VL, 0.5V input overdrive — ±5 — mA VDD = 1.8V — ±23 — mA VDD = 5.
MCP6031/2/3/4 MCP6033 CHIP SELECT ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS =GND, TA = +25°C, VCM = VDD/2, VOUT = VDD/2, VL = VDD/2, CL = 60 pF, RL = 1 MΩ to VL and CS is tied low (Refer to Figure 1-1). Parameters Sym Min Typ Max Units Conditions CS Logic Threshold, Low VIL VSS — 0.2VDD V CS Input Current, Low ICSL — -10 — pA CS Logic Threshold, High VIH 0.
MCP6031/2/3/4 TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
MCP6031/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6031/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL, CL = 60 pF and CS is tied low. PSRR, CMRR (dB) Input Noise Voltage Density (nV/√Hz) 1,000 100 0.1 1E-1 1 1E+0 10 1E+1 100 1E+2 1k 1E+3 10k 1E+4 100k 1E+5 110 105 100 95 90 85 80 75 70 65 60 10000 Input Bias and Offset Currents (pA) 175 150 125 100 75 50 f = 1 kHz VDD = 5.5V 25 10 CMRR, PSRR (dB) Input Bias Current (pA) VDD = 5.
MCP6031/2/3/4 VDD = 5.5V @ VCM = VDD VDD = 1.8V @ VCM = VDD VDD = 5.5V @ VCM = VSS VDD = 1.8V @ VCM = VSS -50 -25 0 25 50 75 100 Ambient Temperature (°C) DC Open-Loop Gain (dB) 7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 TA = +125°C TA = +85°C TA = +25°C TA = -40°C DC Open-Loop Gain (dB) 7.0 5.5 6.0 6.5 5.0 3.5 4.0 4.5 2.0 2.5 3.0 0.5 1.0 1.5 0.
MCP6031/2/3/4 Gain Bandwidth Product (kHz) 120 110 100 90 80 70 Input Referred 60 100 1,000 Frequency (Hz) Gain Bandwidth Product Phase Margin VDD = 5.5V G = +1 V/V 60 Gain Bandwidth Product 50 40 30 VDD = 5.5V G = +1 V/V -50 20 10 0 -25 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. © 2008 Microchip Technology Inc.
MCP6031/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL, CL = 60 pF and CS is tied low. VDD - VOH @ VDD = 1.8V VOL - VSS @ VDD = 1.8V 100 10 VDD - VOH @ VDD = 5.5V VOL - VSS @ VDD = 5.5V 1 10μ 1m 100µ Output Current (A) Time (100 μs/Div) VDD - VOH VSS - VOL -25 FIGURE 2-28: Pulse Response. Output Voltage (20 mV/div) Output Voltage Headroom VDD - V OH or V SS - V OL (mV) VDD = 5.
MCP6031/2/3/4 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Internal CS Switch Ouptut (V) Output Voltage (V) Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL, CL = 60 pF and CS is tied low. VDD = 5.5V G = -1 V/V 4.0 2.5 1.5 0.5 VDD = 3.0V 1.8 Ouptut Voltage (V) Output Voltage (V) Output High-Z 0.0 3.0 2.0 1.0 VDD = 5.0V G = +2 V/V Output On 1.5 Hysteresis 1.2 0.9 CS Input High to Low 0.
MCP6031/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL, CL = 60 pF and CS is tied low. 10k 10000 1k 1000 GN: 101 V/V 11 V/V 1 V/V 100 100 10 10 11 1 10 100 1k 1000 10k 10000 Frequency (Hz) FIGURE 2-37: Closed Loop Output Impedance vs. Frequency. DS22041B-page 12 10m 1.00E-02 1m 1.00E-03 100µ 1.00E-04 10µ 1.00E-05 1µ 1.00E-06 100n 1.00E-07 10n 1.00E-08 1n 1.00E-09 100p 1.00E-10 10p 1.00E-11 1p 1.
MCP6031/2/3/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
MCP6031/2/3/4 4.0 APPLICATION INFORMATION VDD The MCP6031/2/3/4 family of op amps is manufactured using Microchip’s state-of-the-art CMOS process and is specifically designed for low-power, high precision applications. 4.1 D1 R1 Rail-to-Rail Input 4.1.1 PHASE REVERASAL R2 R3 VSS – (minimum expected V1) 2 mA VSS – (minimum expected V2) R2 > 2 mA R1 > INPUT VOLTAGE AND CURRENT LIMITS The ESD protection on the inputs can be depicted as shown in Figure 4-1.
MCP6031/2/3/4 Rail-to-Rail Output The output voltage range of the MCP6031/2/3/4 op amps is VSS + 10 mV (minimum) and VDD – 10 mV (maximum) when RL = 50 kΩ is connected to VDD/2 and VDD = 5.5V. Refer to Figures 2-25 and 2-26 for more information. 4.3 – VOUT CL Output Loads and Battery Life The MCP6031/2/3/4 op amp family has outstanding quiescent current, which supports battery-powered applications. There is minimal quiescent current glitching when Chip Select (CS) is raised or lowered.
MCP6031/2/3/4 4.6 Supply Bypass With this family of operational amplifiers, the power supply pin (VDD for single-supply) should have a local bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good high frequency performance. It can use a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other analog parts. 4.7 Unused Op Amps An unused op amp in a quad package (MCP6034) should be configured as shown in Figure 4-5.
MCP6031/2/3/4 4.9 4.9.1 Application Circuits 4.9.2 BATTERY CURRENT SENSING The MCP6031/2/3/4 op amps’ Common Mode Input Range, which goes 0.3V beyond both supply rails, supports their use in high side and low side battery current sensing applications. The ultra low quiescent current (0.9 µA, typical) helps prolong battery life, and the rail-to-rail output supports detection of low currents. Figure 4-7 shows a high side battery current sensor circuit. The 10Ω resistor is sized to minimize power losses.
MCP6031/2/3/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6031/2/3/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6031/2/3/4 op amps is available on the Microchip web site at www.microchip.com. This model is intended to be an initial design tool that works well in the op amp’s linear region of operation over the temperature range. See the model file for information on its capabilities.
MCP6031/2/3/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 5-Lead SOT-23 (MCP6031) Device XXNN MCP6031T-E/OT 8-Lead 2x3 DFN (MCP6031 & MCP6033) XXX YWW NN EANN EA25 Example: ABV 809 25 Example: 8-Lead MSOP XXXXXX 6031E YWWNNN 809256 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Legend: XX...
MCP6031/2/3/4 Package Marking Information (Continued) 14-Lead SOIC (150 mil) (MCP6034) Example: XXXXXXXXXX XXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP6034) XXXXXX YYWW NNN Legend: XX...
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MCP6031/2/3/4 APPENDIX A: REVISION HISTORY Revision B (March 2008) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. 8. Added SOT-23-5 and 2x3 DFN packages. Added test circuits. Corrected VOS temperature drift information. Added Section 4.9.3. Updated Package Marking Information. Updated all package outline drawings and added package outline drawings for SOT-23-5 and 2x3 DFN packages. Added Landing Pattern drawings for 2x3 DFN and 8-lead SOIC packages.
MCP6031/2/3/4 NOTES: DS22041B-page 30 © 2008 Microchip Technology Inc.
MCP6031/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6031/2/3/4 NOTES: DS22041B-page 32 © 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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