Datasheet

© 2008 Microchip Technology Inc. DS22041B-page 29
MCP6031/2/3/4
APPENDIX A: REVISION HISTORY
Revision B (March 2008)
The following is the list of modifications:
1. Added SOT-23-5 and 2x3 DFN packages.
2. Added test circuits.
3. Corrected V
OS
temperature drift information.
4. Added Section 4.9.3.
5. Updated Package Marking Information.
6. Updated all package outline drawings and
added package outline drawings for SOT-23-5
and 2x3 DFN packages.
7. Added Landing Pattern drawings for 2x3 DFN
and 8-lead SOIC packages.
8. Updated information in Product Identification
System for SOT-23-5 and 2x3 DFN packages.
Revision A (March 2007)
• Original Release of this Document.