User manual
Table Of Contents
MCP6031 PHOTODIODE PICtail™
PLUS DEMO BOARD USER’S GUIDE
© 2008 Microchip Technology Inc. DS51763A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History................................................................................... 3
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 5
1.2 MCP6031 Photodiode PICtail™ Plus Demo Board Kit Contents ................... 5
1.3 MCP6031 Photodiode PICtail™ Plus Demo Board Description .................... 6
Chapter 2. Installation and Operation
2.1 Introduction ..................................................................................................... 9
2.2 Required Tool ................................................................................................. 9
2.3 MCP6031 Photodiode PICtail™ Plus Demo Board Set-up ........................... 9
2.4 MCP6031 Photodiode PICtail™ Plus Demo Board Operation .................... 10
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 11
A.2 Board - Schematic ....................................................................................... 12
A.3 Board - Top Silk Layer ................................................................................ 13
A.4 Board - Top Metal And Top Silk Layers ....................................................... 13
A.5 Board - Bottom Metal Layer ......................................................................... 14
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 16