Datasheet

MCP601/1R/2/3/4
DS21314G-page 4 © 2007 Microchip Technology Inc.
1.1 Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-2. The bypass
capacitors are laid out according to the rules discussed
in Section 4.5 “Supply Bypass”.
FIGURE 1-2: AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
FIGURE 1-3: AC and DC Test Circuit for
Most Inverting Gain Conditions.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
DD
= +2.7V to +5.5V and V
SS
= GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
-40 +85 °C Industrial temperature parts
T
A
-40 +125 °C Extended temperature parts
Operating Temperature Range T
A
-40 +125 °C Note
Storage Temperature Range T
A
-65 +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23 θ
JA
—256—°C/W
Thermal Resistance, 6L-SOT23 θ
JA
—230—°C/W
Thermal Resistance, 8L-PDIP θ
JA
—85—°C/W
Thermal Resistance, 8L-SOIC θ
JA
—163—°C/W
Thermal Resistance, 8L-TSSOP θ
JA
—124—°C/W
Thermal Resistance, 14L-PDIP θ
JA
—70—°C/W
Thermal Resistance, 14L-SOIC θ
JA
—120—°C/W
Thermal Resistance, 14L-TSSOP θ
JA
—100—°C/W
Note: The Industrial temperature parts operate over this extended range, but with reduced performance. The
Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction
temperature (T
J
) must not exceed the absolute maximum specification of 150°C.
V
DD
MCP60X
R
G
R
F
R
N
V
OUT
V
IN
V
DD
/2
F
C
L
R
L
V
L
0.1 µF
V
DD
MCP60X
R
G
R
F
R
N
V
OUT
V
DD
/2
V
IN
F
C
L
R
L
V
L
0.1 µF