Datasheet

 2008-2013 Microchip Technology Inc. DS22107B-page 35
MCP454X/456X/464X/466X
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follow.
TABLE 3-1: PINOUT DESCRIPTION FOR THE MCP454X/456X/464X/466X
Pin
Weak
Pull-up/
down
(1)
Standard Function
Single Dual
Symbol I/O
Buffer
Type
Rheo Pot
(1)
Rheo Pot
8L 8L 10L 14L 16L
1 1 1 1 16 HVC/A0 I HV w/ST “smart” High Voltage Command /
Address 0.
2 2 2 2 1 SCL I HV w/ST No I
2
C clock input.
3 3 3 3 2 SDA I/O HV w/ST No I
2
C serial data I/O. Open Drain
output
44443, 4 V
SS
— P — Ground
— — 5 5 5 P1B A Analog No Potentiometer 1 Terminal B
— — 6 6 6 P1W A Analog No Potentiometer 1 Wiper Terminal
— — — 7 7 P1A A Analog No Potentiometer 1 Terminal A
— 5 — 8 8 P0A A Analog No Potentiometer 0 Terminal A
5 6 7 9 9 P0W A Analog No Potentiometer 0 Wiper Terminal
6 7 8 10 10 P0B A Analog No Potentiometer 0 Terminal B
———1112 WP
I HV w/ST “smart” Hardware EEPROM Write
Protect
— — — 12 13 A2 I HV w/ST “smart” Address 2
7 — 9 13 14 A1 I HV w/ST “smart” Address 1
8 8 10 14 15 V
DD
— P — Positive Power Supply Input
— — — — 11 NC — — — No Connection
9 9 11 — 17 EP — — — Exposed Pad (Note 2)
Legend: HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals) I = digital input (high Z)
O = digital output I/O = Input / Output
P = Power
Note 1: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shut-
down current.
2: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s V
SS
pin.