Datasheet

 2008-2012 Microchip Technology Inc. DS22107B-page 97
MCP454X/456X/464X/466X
APPENDIX A: REVISION HISTORY
Revision B (February 2013)
The following is the list of modifications:
1. Updated the DFN package pinout on page 1.
2. Updated the Absolute Maximum Ratings† page
format and added Total Power Dissipation
values for each package type.
3. Updated the typical thermal package resistance
values for the 8L-DFN (3x3) and 8L-SOIC pack-
ages in the Temperature characteristics table.
4. Added new Figure 2-59 to Section 2.1 “Test
Circuits”.
5. Corrected values in Figure 5-1.
6. Added description of wiper value on POR/BOR
(Section 5.2 “Wiper”).
7. Removed Section 8.1.
8. Added Section 8.4 “Implementing Log Steps
with a Linear Digital Potentiometer”.
9. Added Section 8.5.2.2 “Footprint Compatibil-
ity”.
10. Added Section 8.5.2.3 “PCB Area Require-
ments”.
11. Updated Table 8-2.
12. Enhanced the listing of development tools and
technical documentation in Section 10.0
“Development support”.
13. Updated Table 10-1 and Table 10-2.
14. Updated Section 11.0 “Packaging Informa-
tion” with package available landing pattern
diagrams.
Revision A (November 2008)
• Original Release of this Document.