Datasheet

 2008-2013 Microchip Technology Inc. DS22096B-page 91
MCP453X/455X/463X/465X
APPENDIX A: REVISION HISTORY
Revision B (February 2013)
The following is the list of modifications:
1. Corrected MCP45x1 DFN package pinout.
2. Corrected Device Block Diagram.
3. Updated the Absolute Maximum Ratings †
with Total Power Dissipation values for each
package type.
4. Updated typical thermal values in Temperature
Characteristics table.
5. Corrected labeling in Figure 2-1, from
Section 2.0 “Typical Performance Curves”.
Also corrected Figure 2-4.
6. Appropriate 1.8V Graphs in Section 2.0 “Typi-
cal Performance Curves” now reference
Appendix B: “Characterization Data Analy-
sis”.
7. Added new Figure 2-66.
8. Corrected values in Figure 5-1.
9. Added description of wiper value on POR/BOR
(Section 5.2 “Wiper”).
10. Added new section Section 8.5 “Implementing
Log Steps with a Linear Digital
Potentiometer”.
11. Added information in the Development Tools
Section (Section 10.0 “Development
support”).
12. Updated packaging section with package
available landing pattern diagrams.
13. Added Appendix B: “Characterization Data
Analysis”.
14. Updated the format of the Absolute Maximum
Ratings † page in Section 1.0 “Electrical
Characteristics”.
15. Clarified actions of the POR in Section 4.1.1
“Power-on Reset”.
16. Removed Note 3 from Table 10-1.
Revision A (November 2008)
• Original Release of this Document.