User manual

Installation and Operation

 2010 Microchip Technology Inc. DS51898A-page 17

TABLE 2-2: OPTIONAL PASSIVE COMPONENTS – NOT INSTALLED

(2)

Component Comment

C1, C2 Power supply bypass capacitors

(3)

C3, C4 PIC

MCU Crystal capacitors

R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U,

R9U, R12U, R13U, R16U, R18U, R19U, R20U

Pull-up resistor

R1D, R2D, R3D, R4D, R5D, R6D, R8D, R9D,

R10D, R11D, R12D, R14D, R15D, R16D, R17D,

R18D, R19D, R20D

Pull-down resistor

(1)

U1, U2 Alternate package footprints

VDD, GND Power and Ground plane connection

points

Y1 Can connect to either PIC

MCUs main

oscillator or to the Timer oscillator circuit.

P1, P2, P3, P4, P5, P6, P8, P10, P11, P13, P14,

P15, P16, P17, P18, P19, P20

Test Point connectors

Note 1: Whichever pin is the device’s V

pin, that corresponding RXD footprint can be

used for the device’s bypass capacitor. So if Pin 8 is the device’s V

pin, then

install the bypass capacitor in the R8D footprint.

2: All passive components use the surface mount 805 footprint.

3: If the board is powered via the V

and GND connection points, the use of bypass

capacitors on C1 and C2 may improve performance. The benefit is reduced if the

board is powered via the PICkit™ serial interface.