Datasheet

MCP42XX PICTAIL™ PLUS
DAUGHTER BOARD USER’S GUIDE
© 2008 Microchip Technology Inc. DS51759A-page 37
Appendix B. Bill Of Materials (BOM)
TABLE B-1: BILL OF MATERIALS (BOM)
Qty Reference Description Manufacturer Part Number
1 C1 CAP .1UF 25V CERAMIC X7R 0805 Panasonic
®
- ECG ECJ-2VB1E104K
1 C2 CAP 1.0UF 16V CERAMIC X7R 0805 Kemet
®
Electronics C0805C105K4RACTU
1 J1 CONN HEADER 6POS .100 VERT TIN Molex/Waldom
®
Electronics Corp
22-28-4060
3 JP1, JP2, JP3 CONN HEADER 2POS .100 VERT TIN Molex/Waldom
Electronics
22-03-2021
4 JMP1, JMP2,
JMP3, JMP4
CONN HEADER 3POS .100" STR TIN Molex/Waldom
Electronics Corp
90120-0123
1 PCB RoHS Compliant Bare PCB,
MCP4XXX PICTail Plus Daughter Board
Microchip Technology
Inc.
104-00182
1 R1 RES 100 OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF1000V
10 R2, R3, R4, R5,
R6, R7, R8, R9,
R11, R16
RES 10.0K OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6ENF1002V
3 R14, R15, R18 RES 0.0 OHM 1/8W 5% 0805 SMD Rohm MCR10EZPJ000
1 U1 C,ANALOG MUX,DUAL,4-CHAN-
NEL,CMOS,SSOP,16PIN,PLASTIC
16-QSOP
Maxim MAX4582LEEE
1 U2 MCP414X/416X/424, 7/8-Bit Single/Dual
SPI Digital POT with Non-Volatile Mem-
ory
Microchip Technology
Inc.
MCP4261T-103E/ST
12 VA0, VW0, VB0,
VA1, VW1, VB1,
VSS, AVDD
PC TEST POINT COMPACT SMT Keystone
Electronics
®
5016
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-2: BILL OF MATERIALS — COMPONENTS NOT INSTALLED
Qty Reference Description Manufacturer Part Number
0 J2 DO NOT POPULATE
CONN HEADER 6POS .100 VERT TIN
——
0 R10, R12, R13,
R17
DO NOT POPULATE — —
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.