Datasheet
© 2008 Microchip Technology Inc. DS22059B-page 27
MCP414X/416X/424X/426X
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Ta ble 3 -1 .
Additional descriptions of the device pins follows.
TABLE 3-1: PINOUT DESCRIPTION FOR THE MCP414X/416X/424X/426X
Pin
Weak
Pull-up/
down
(Note 2)
Standard Function
Single Dual
Symbol I/O
Buffer
Type
Rheo Pot
(1)
Rheo Pot
8L 8L 10L 14L 16L
111116 CS I HV w/ST “smart”
SPI Chip Select Input
2 2 2 2 1 SCK I HV w/ST “smart”
SPI Clock Input
3 — 3 3 2 SDI I HV w/ST “smart”
SPI Serial Data Input
— 3 — — — SDI/SDO I/O HV w/ST “smart”
SPI Serial Data Input/Output
(Note 1, Note 3)
44443, 4 V
SS
—P —
Ground
— — 5 5 5 P1B A Analog No
Potentiometer 1 Terminal B
— — 6 6 6 P1W A Analog No
Potentiometer 1 Wiper Terminal
— — — 7 7 P1A A Analog No
Potentiometer 1 Terminal A
— 5 — 8 8 P0A A Analog No
Potentiometer 0 Terminal A
5 6 7 9 9 P0W A Analog No
Potentiometer 0 Wiper Terminal
6 7 8 10 10 P0B A Analog No
Potentiometer 0 Terminal B
———1112 WP
I I “smart”
Hardware EEPROM Write
Protect
— — — 12 13 SHDN
I HV w/ST “smart”
Hardware Shutdown
7 — 9 13 14 SDO O O No
SPI Serial Data Out
8 8 10 14 15 V
DD
—P —
Positive Power Supply Input
————11 NC — — —
No Connection
9911—17 EP — — —
Exposed Pad. (Note 4)
Legend: HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals) I = digital input (high Z)
O = digital output I/O = Input / Output
P = Power
Note 1: The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
2: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shut-
down current.
3: The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
4: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s V
SS
pin.