Datasheet

© 2008 Microchip Technology Inc. DS22059B-page 83
MCP414X/416X/424X/426X
APPENDIX A: REVISION HISTORY
Revision B (December 2008)
The following is the list of modifications:
1. Updated I
PU
specifications to specify test
conditions and new limit.
2. Updated DFN and QFN package in “Package
Types (top view)”, to include Exposed Thermal
Pad samples (EP).
3. Added new descriptions in Section 3.0 “Pin
Descriptions”.
4. Added new Development Tool support item.
5. Updated Package Outline section.
Revision A (August 2007)
• Original Release of this Document.
APPENDIX B: MIGRATING FROM
THE MCP41XXX AND
MCP42XXX DEVICES
This is intended to give an overview of some of the
differences to be aware of when migrating from the
MCP41XXX and MCP42XXX devices.
B.1 MCP41XXX to MCP41XX
Differences
Here are some of the differences to be aware of:
1. SI pin is now SDI/SDO pin, and the contents of
the device memory can be read
2. Need to address the Terminal Connect Feature
(TCON register) of MCP41XX
3. MCP41XX supports software Shutdown mode
4. New 5 kΩ version
5. MCP41XX have 7-bit resolution options
6. MCP41XX are Non-Volatile
7. Alternate pinout versions (for Rheostat
configuration)
8. Verify device’s electrical specifications
9. Interface signals are now high voltage tolerant
10. Interface signals now have internal pull-up
resistors
B.2 MCP42XXX to MCP42XX
Differences
Here are some of the differences to be aware of:
1. Hardware Reset (RS
) pin replace by Hardware
Write Protect (WP
) pin
2. Daisy chaining of devices is no longer supported
3. SDO pin allows contents of device memory to be
read
4. Need to address the Terminal Connect Feature
(TCON register) of MCP42XX
5. MCP42XX supports software Shutdown mode
6. New 5 kΩ version
7. MCP42XX have 7-bit resolution options
8. MCP42XX are Non-Volatile
9. Alternate package/pinout versions (for Rheostat
configuration)
10. Verify device’s electrical specifications
11. Interface signals are now high voltage tolerant
12. Interface signals now have internal pull-up
resistors