Datasheet

© 2006 Microchip Technology Inc. DS21945E-page 55
MCP4021/2/3/4
6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.500.430.35.020.017.014BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
10501050
φ
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.102.952.80.122.116.110DOverall Length
1.751.631.50.069.064.059E1Molded Package Width
3.002.802.60.118.110.102EOverall Width
0.150.080.00.006.003.000A1Standoff
1.301.100.90.051.043.035A2Molded Package Thickness
1.451.180.90.057.046.035AOverall Height
1.90 BSC.075 BSC
p1
Outside lead pitch
0.95 BSC.038 BSC
p
Pitch
66
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES
* Units
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
Notes:
JEITA (formerly EIAJ) equivalent: SC-74A
* Controlling Parameter
Drawing No. C04-120
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
Revised 09-12-05