Datasheet

MCP4021/2/3/4
DS21945E-page 56 © 2006 Microchip Technology Inc.
8-Lead Plastic Dual-Flat No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Units
Dimension Limits
N
e
A
A1
A3
D
E
D2
E2
b
L
K
0.80
0.00
1.30
1.50
0.18
0.30
0.20
8
0.50 BSC
0.90
0.02
0.20 REF
2.00 BSC
3.00 BSC
—
—
0.25
0.40
—
1.00
0.05
1.75
1.90
0.30
0.50
—
MIN
NOM MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–123, Sept. 8, 2006
A3
A1
NOTE 2
NOTE 1
NOTE 1
E2
D2
BOTTOM VIEW
EXPOSED PAD
K
L
1
2
N
e
b
TOP VIEW
2
1
N
D
E
A