User manual
Bill Of Materials (BOM)
2010 Microchip Technology Inc. DS51845B-page 37
1 TP1 Wire Test Point 0.3" Length Component Corporation PJ-202-30
1 U1 IC REG LDO 800MA 5.0V SOT-223 National Semiconductor LM1117MP-5.0/NOPB
1 U2 IC PIC USB MCU FLASH 48KX16
80TQFP
Microchip PIC18F86J55-I/PT
1 U3 IC REG LDO 800MA 3.3V SOT-223 National
Semiconductor
®
LM1117MP-3.3/NOPB
1 U4 IC ENERGY METER 24SSOP Microchip Technology
Inc.
MCP3901-I/SS
1 U5 IC SRAM 4MB ASYNC 44-TSOPII ISSI, Integrated Silicon
Solution Inc
IS61LV5128AL-10TLI
1 U6 IC DRVR/RCVR MLTCH RS232
20TSSOP
Texas Instruments SN75C3223PW
1 U8 2.7V Voltage Supervisor SOT-23-3 Microchip Technology
Inc.
MCP130T-270I/TT
1 X1 CRYSTAL 48.0000MHZ 10PF SMD Abracon Corporation ABM3B-48.000MHZ-10-1-U-T
1 X2 CRYSTAL 3.579545MHZ
18PFFUND SMD
Abracon Corporation ABLS-3.579545MHZ-B2-T
1 X3 CRYSTAL 7.3728MHZ 18PF FUND
SMD
Abracon Corporation ABLS-7.3728MHZ-B2-T
TABLE B-1: BILL OF MATERIALS (CONTINUED)
Qty Reference Description Manufacturer Part Number
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.
TABLE B-2: BILL OF MATERIALS — COMPONENTS NOT INSTALLED
Qty Reference Description Manufacturer Part Number
J4 DO NOT INSTALL
120-pin MINI EDGE CARD
SOCKET
SAMTEC MEC1-160-02-L-D-A
1 LCD1 DO NOT INSTALL — —
1 P9 DO NOT INSTALL — —
13 R1, R2, R3,
R4 R6, R8,
R9, R10, R17,
R18, R25
R29, R35
DO NOT INSTALL — —
1 U7 DO NOT INSTALL — —
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.