Datasheet

MCP3424 EVALUATION BOARD
USER’S GUIDE
© 2008 Microchip Technology Inc. DS51737A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History................................................................................... 3
Chapter 1. Quick Start Instructions
1.1 Introduction ..................................................................................................... 5
1.2 Description of the MCP3424 Evaluation Board .............................................. 5
1.3 Getting Started with PICkit™ Serial Analyzer ................................................ 6
1.4 Experiment with Inputs Other Than CH1 ...................................................... 21
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 23
A.2 Board – Schematic ....................................................................................... 24
A.3 Board – Top Layer ....................................................................................... 25
A.4 Board – Top Metal Layer ............................................................................. 26
A.5 Board – Bottom Layer ................................................................................. 27
A.6 Board – Bottom Metal Layer ........................................................................ 28
Appendix B. Bill Of Materials (BOM)
Worldwide Sales and Service .................................................................................... 30