User manual

MCP3423 EVALUATION BOARD
USER’S GUIDE
© 2008 Microchip Technology Inc. DS51778A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History ................................................................................... 3
Chapter 1. Quick Start Instructions
1.1 Introduction ..................................................................................................... 5
1.2 Description of the MCP3423 Evaluation Board .............................................. 5
1.3 Getting Started with PICkit Serial Analyzer .................................................... 6
1.4 Experiment for CH2 ...................................................................................... 22
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 23
A.2 Board – Schematic ....................................................................................... 24
A.3 Board – Top Laer ......................................................................................... 25
A.4 Board – Top Metal Layer ............................................................................. 26
A.5 Board – Bottom Layer .................................................................................. 27
A.6 Board – Bottom Metal Layer ........................................................................ 28
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 30