Datasheet

MCP3301
DS21700E-page 22  2001-2011 Microchip Technology Inc.
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
NNN
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information.
3
e
3
e
8-Lead SOIC (3.90 mm) Example
3301-BI
SN 1130
3
8-Lead PDIP (300 mil) Example
8-Lead MSOP (3x3 mm) Example
3301-BI
I/P 256
1130
3
3301CI
130256