Datasheet
Table Of Contents
- Features
- Applications
- Description
- Package Types
- Functional Block Diagram
- 1.0 Electrical Characteristics
- PIN FUNCTION TABLE
- electrical characteristics
- 2.0 Typical Performance Characteristics
- FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample Rate.
- FIGURE 2-2: Integral Nonlinearity (INL) vs. Vref.
- FIGURE 2-3: Integral Nonlinearity (INL) vs. Code (Representative Part).
- FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample Rate (Vdd = 2.7V).
- FIGURE 2-5: Integral Nonlinearity (INL) vs. Vref (Vdd = 2.7V).
- FIGURE 2-6: Integral Nonlinearity (INL) vs. Code (Representative Part, Vdd = 2.7V).
- FIGURE 2-7: Integral Nonlinearity (INL) vs. Temperature.
- FIGURE 2-8: Differential Nonlinearity (DNL) vs. Sample Rate.
- FIGURE 2-9: Differential Nonlinearity (DNL) vs. Vref.
- FIGURE 2-10: Integral Nonlinearity (INL) vs. Temperature (Vdd = 2.7V).
- FIGURE 2-11: Differential Nonlinearity (DNL) vs. Sample Rate (Vdd = 2.7V).
- FIGURE 2-12: Differential Nonlinearity (DNL) vs. Vref (Vdd = 2.7V).
- FIGURE 2-13: Differential Nonlinearity (DNL) vs. Code (Representative Part).
- FIGURE 2-14: Differential Nonlinearity (DNL) vs. Temperature.
- FIGURE 2-15: Gain Error vs. Vref.
- FIGURE 2-16: Differential Nonlinearity (DNL) vs. Code (Representative Part, Vdd = 2.7V).
- FIGURE 2-17: Differential Nonlinearity (DNL) vs. Temperature (Vdd = 2.7V).
- FIGURE 2-18: Offset Error vs. Vref.
- FIGURE 2-19: Gain Error vs. Temperature.
- FIGURE 2-20: Signal to Noise Ratio (SNR) vs. Input Frequency.
- FIGURE 2-21: Total Harmonic Distortion (THD) vs. Input Frequency.
- FIGURE 2-22: Offset Error vs. Temperature.
- FIGURE 2-23: Signal to Noise Ratio and Distortion (SINAD) vs. Input Frequency.
- FIGURE 2-24: Signal to Noise and Distortion (SINAD) vs. Input Signal Level.
- FIGURE 2-25: Effective Number of Bits (ENOB) vs. Vref.
- FIGURE 2-26: Spurious Free Dynamic Range (SFDR) vs. Input Frequency.
- FIGURE 2-27: Frequency Spectrum of 10kHz Input (Representative Part).
- FIGURE 2-28: Effective Number of Bits (ENOB) vs. Input Frequency.
- FIGURE 2-29: Power Supply Rejection (PSR) vs. Ripple Frequency.
- FIGURE 2-30: Frequency Spectrum of 1kHz Input (Representative Part, Vdd = 2.7V).
- FIGURE 2-31: Idd vs. Vdd.
- FIGURE 2-32: Idd vs. Clock Frequency.
- FIGURE 2-33: Idd vs. Temperature.
- FIGURE 2-34: Iref vs. Vdd.
- FIGURE 2-35: Iref vs. Clock Frequency.
- FIGURE 2-36: Iref vs. Temperature.
- FIGURE 2-37: Idds vs. Vdd.
- FIGURE 2-38: Idds vs. Temperature.
- FIGURE 2-39: Analog Input Leakage Current vs. Temperature.
- 3.0 Pin Descriptions
- 4.0 Device Operation
- 5.0 Serial Communications
- 6.0 Applications Information
- 7.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
MCP3001
DS21293C-page 4 © 2007 Microchip Technology Inc.
FIGURE 1-1: Serial Timing.
Power Requirements:
Operating Voltage V
DD
2.7 — 5.5 V
Operating Current I
DD
—400
210
500 µA
µA
V
DD
= 5.0V, D
OUT
unloaded
V
DD
= 2.7V, D
OUT
unloaded
Standby Current I
DDS
—0.005 2 µACS = V
DD
= 5.0V
All parameters apply at V
DD
= 5V, V
SS
= 0V, V
REF
= 5V, T
AMB
= -40°C to +85°C, f
SAMPLE
= 200 ksps and f
CLK
= 14*f
SAMPLE
,
unless otherwise noted. Typical values apply for V
DD
= 5V, T
AMB
=25°C, unless otherwise noted.
Parameter Sym Min Typ Max Units Conditions
Note 1: This parameter is guaranteed by characterization and not 100% tested.
2: See graph that relates linearity performance to V
REF
level.
3: Because the sample cap will eventually lose charge, clock rates below 10 kHz can affect linearity perfor-
mance, especially at elevated temperatures.
CS
CLK
t
SUCS
t
CSH
t
HI
t
LO
D
OUT
t
EN
t
DO
t
R
t
F
LSB
MSB OUT
t
DIS
Null BIT
HI-Z
HI-Z