Datasheet
Table Of Contents
- Features
- Applications
- Description
- Package Types
- Functional Block Diagram
- 1.0 Electrical Characteristics
- PIN FUNCTION TABLE
- electrical characteristics
- 2.0 Typical Performance Characteristics
- FIGURE 2-1: Integral Nonlinearity (INL) vs. Sample Rate.
- FIGURE 2-2: Integral Nonlinearity (INL) vs. Vref.
- FIGURE 2-3: Integral Nonlinearity (INL) vs. Code (Representative Part).
- FIGURE 2-4: Integral Nonlinearity (INL) vs. Sample Rate (Vdd = 2.7V).
- FIGURE 2-5: Integral Nonlinearity (INL) vs. Vref (Vdd = 2.7V).
- FIGURE 2-6: Integral Nonlinearity (INL) vs. Code (Representative Part, Vdd = 2.7V).
- FIGURE 2-7: Integral Nonlinearity (INL) vs. Temperature.
- FIGURE 2-8: Differential Nonlinearity (DNL) vs. Sample Rate.
- FIGURE 2-9: Differential Nonlinearity (DNL) vs. Vref.
- FIGURE 2-10: Integral Nonlinearity (INL) vs. Temperature (Vdd = 2.7V).
- FIGURE 2-11: Differential Nonlinearity (DNL) vs. Sample Rate (Vdd = 2.7V).
- FIGURE 2-12: Differential Nonlinearity (DNL) vs. Vref (Vdd = 2.7V).
- FIGURE 2-13: Differential Nonlinearity (DNL) vs. Code (Representative Part).
- FIGURE 2-14: Differential Nonlinearity (DNL) vs. Temperature.
- FIGURE 2-15: Gain Error vs. Vref.
- FIGURE 2-16: Differential Nonlinearity (DNL) vs. Code (Representative Part, Vdd = 2.7V).
- FIGURE 2-17: Differential Nonlinearity (DNL) vs. Temperature (Vdd = 2.7V).
- FIGURE 2-18: Offset Error vs. Vref.
- FIGURE 2-19: Gain Error vs. Temperature.
- FIGURE 2-20: Signal to Noise Ratio (SNR) vs. Input Frequency.
- FIGURE 2-21: Total Harmonic Distortion (THD) vs. Input Frequency.
- FIGURE 2-22: Offset Error vs. Temperature.
- FIGURE 2-23: Signal to Noise Ratio and Distortion (SINAD) vs. Input Frequency.
- FIGURE 2-24: Signal to Noise and Distortion (SINAD) vs. Input Signal Level.
- FIGURE 2-25: Effective Number of Bits (ENOB) vs. Vref.
- FIGURE 2-26: Spurious Free Dynamic Range (SFDR) vs. Input Frequency.
- FIGURE 2-27: Frequency Spectrum of 10kHz Input (Representative Part).
- FIGURE 2-28: Effective Number of Bits (ENOB) vs. Input Frequency.
- FIGURE 2-29: Power Supply Rejection (PSR) vs. Ripple Frequency.
- FIGURE 2-30: Frequency Spectrum of 1kHz Input (Representative Part, Vdd = 2.7V).
- FIGURE 2-31: Idd vs. Vdd.
- FIGURE 2-32: Idd vs. Clock Frequency.
- FIGURE 2-33: Idd vs. Temperature.
- FIGURE 2-34: Iref vs. Vdd.
- FIGURE 2-35: Iref vs. Clock Frequency.
- FIGURE 2-36: Iref vs. Temperature.
- FIGURE 2-37: Idds vs. Vdd.
- FIGURE 2-38: Idds vs. Temperature.
- FIGURE 2-39: Analog Input Leakage Current vs. Temperature.
- 3.0 Pin Descriptions
- 4.0 Device Operation
- 5.0 Serial Communications
- 6.0 Applications Information
- 7.0 Packaging Information
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS21293C-page25
MCP3001
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX
PackageTemperature
Range
Device
Device: MCP3001: 10-Bit Serial A/D Converter
MCP3001T: 10-Bit Serial A/D Converter
(Tape and Reel) (SOIC and TSSOP only)
Temperature Range: I = -40°C to +85°C
Package: P = Plastic DIP (300 mil Body), 8-lead
SN = Plastic SOIC (150 mil Body), 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
Examples:
a) MCP3001-I/P: Industrial Temperature,
PDIP package.
b) MCP3001-I/SN: Industrial Temperature,
SOIC package.
c) MCP3001-I/ST: Industrial Temperature,
TSSOP package.
d) MCP3001-I/MS: Industrial Temperature,
MSOP package.