User manual
MCP2515 PICTAIL™ PLUS DAUGHTER
BOARD USER’S GUIDE
© 2008 Microchip Technology Inc. DS51762A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History................................................................................... 3
Chapter 1. Product Overview
1.1 Overview ........................................................................................................ 5
1.2 What is the MCP2515 PICtail Plus Daughter Board? .................................... 5
1.3 What the MCP2515 PICtail Plus Daughter Board Kit includes ....................... 6
Chapter 2. Installation and Operation
2.1 Hardware Overview ........................................................................................ 7
2.2 Connecting the Board ..................................................................................... 7
2.3 Operation ........................................................................................................ 7
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................... 9
A.2 Board Schematic .......................................................................................... 10
A.3 Board - Top Layer ........................................................................................ 11
A.4 Board - Top Layer and Silkscreen Layer .................................................... 11
A.5 Board - Bottom Layer ................................................................................... 12
Appendix B. Bill Of Materials (BOM)
Worldwide Sales and Service .................................................................................... 14