Datasheet

 2003-2012 Microchip Technology Inc. DS21801G-page 87
MCP2515
APPENDIX A: REVISION HISTORY
Revision G (August 2012)
The following is the list of modifications:
1. Updated content in Register 4-1, Register 4-12,
Register 4-13, Register 4-16, Register 4-17.
Revision F (October 2010)
The following is the list of modifications:
1. Added 20-lead QFN package (4x4) and related
information.
2. Updated Table 1-1 .
3. Updated the Product Identification System
section.
Revision E (November 2007)
• Removed preliminary watermark.
• Updated templates.
• Updated register information.
• Updated package outline drawings.
Revision D (April 2005)
• Added Table 8-1 and Tabl e 8-2 in Section 8.0
“Oscillator”. Added note box following tables.
• Changed address bits in column heading in
Table 11-1, Section 11.0 “Register Map”.
• Modified Section 14.0 “Packaging Information”
to reflect pb free device markings.
• Appendix A Revision History: Rearranged order of
importance.
Revision C (November 2004)
• Section 9.0 “RESET” added.
• Heading 12.1: added notebox.
Heading 12.6: Changed verbiage within
paragraph in Section 12.0 “SPI Interface”.
• Added Appendix A: Revision History.
Revision B (September 2003)
• Front page bullet: Standby current (typical) (Sleep
mode) changed from 10 µA to 1 µA.
• Added notebox for maximum frequency on
CLKOUT in Section 8.2 “CLKOUT Pin”.
• Section 12.0 “SPI Interface”, Table 12-1:
- Changed supply voltage minimum to 2.7V.
- Internal Capacitance: Changed V
DD condition
to 0V.
- Standby Current (Sleep mode): Split
specification into -40°C to +85°C and
-40°C to +125°C.
Revision A (May 2003)
• Original Release of this Document.