Information

© 2007 Microchip Technology Inc. DS80311A-page 3
MCP23S17
APPENDIX B: SILICON REVISION
HISTORY
The following table and package marking information
indicates how to determine the revision of the DSTEMP
device. The revision information can be determined by
the Year and Week Code of the manufacturer printed
on the device.
TABLE B-1: SILICON REVISION/DEVICE
MARKING
Package Marking Information
Silicon
Revision
YYWWNNN
Comments
Start Date End Date
Rev A2 XXXXNNN XXXXNNN In Production
Rev A0 — XXXXNNN
Legend: “N” is any alphanumeric character.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
28-Lead SOIC
28-Lead PDIP (Skinny DIP)
28-Lead SSOP
0648256
MCP23S17
28-Lead QFN
E/SS^^
3
e
MCP23S17-E/SP^^
0648256
3
e
0648256
MCP23S17-E/SO^^
3
e
23S17
E/ML ^^
0648256
3
e