Datasheet
© 2007 Microchip Technology Inc. DS21952B-page 41
MCP23017/MCP23S17
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device MCP23017: 16-Bit I/O Expander w/I
2
C™ Interface
MCP23017T: 16-Bit I/O Expander w/I
2
C Interface
(Tape and Reel)
MCP23S17: 16-Bit I/O Expander w/SPI Interface
MCP23S17T: 16-Bit I/O Expander w/SPI Interface
(Tape and Reel)
Temperature
Range E = -40°C to +125°C (Extended)
Package ML = Plastic Quad, Flat No Leads (QFN), 28-lead
SP = Plastic DIP (300 mil Body), 28-Lead
SO = Plastic SOIC (300 mil Body), 28-Lead
SS = SSOP, (209 mil Body, 5.30 mm), 28-Lead
PART NO. X /XX
PackageTemperature
Range
Device
Examples:
a) MCP23017-E/SP: Extended Temp.,
28LD PDIP package.
b) MCP23017-E/SO: Extended Temp.,
28LD SOIC package.
c) MCP23017T-E/SO: Tape and Reel,
Extended Temp.,
28LD SOIC package.
d) MCP23017-E/SS: Extended Temp.,
28LD SSOP package.
e) MCP23017T-E/SS: Tape and Reel,
Extended Temp.,
28LD SSOP package.
a) MCP23S17-E/SP: Extended Temp.,
28LD PDIP package.
b) MCP23S17-E/SO: Extended Temp.,
28LD SOIC package.
c) MCP23S17T-E/SO: Tape and Reel,
Extended Temp.,
28LD SOIC package.
d) MCP23S17-E/SS: Extended Temp.,
28LD SSOP package.
e) MCP23S17T-E/SS: Tape and Reel,
Extended Temp.,
28LD SSOP package.
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