Datasheet
Table Of Contents
- Features
- CMOS Technology
- Packages
- Package Types
- Block Diagram
- 1.0 Device OvervieW
- 1.1 Pin Descriptions
- 1.2 Power-on Reset (POR)
- 1.3 Power-up Timer (PWRT)
- 1.4 Clock Generator
- 1.5 I2C Bus Interface/ Protocol Handler
- 1.6 Address Decoder
- 1.7 Register Block
- 1.8 Serializer/Deserializer
- 1.9 Interrupt Logic
- 2.0 Electrical Characteristics
- 2.1 DC Characteristics
- TABLE 2-1: DC Characteristics
- FIGURE 2-1: respOnse time
- TABLE 2-2: response time
- FIGURE 2-2: TEST POINT Clock Timing
- TABLE 2-3: TEST POINT Clock Timing
- TABLE 2-4: Power-up Timer Requirements
- FIGURE 2-3: I2C Bus Start/Stop Bits Timing
- FIGURE 2-4: I2C Bus Data Timing
- TABLE 2-5: I2C Bus Data Requirements
- FIGURE 2-5: GP0 and GP1 POrt Timings
- 2.1 DC Characteristics
- 3.0 Package InFormation
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS20090C-page 35
MCP23016
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information (e.g., on pricing or delivery) refer to the factory or the listed sales office.
PART NO.
X /XX
PackageTemperature
Range
Device
Device: DSTEMP: 16-Bit I
2
C I/O Expander
Temperature
Range:
I= -40°C to +85°C
Package: SP = Plastic DIP (300 mil Body), 28-lead
SO = Plastic SOIC, Wide (300 mil Body), 28-lead
SS = Plastic SOIC, (209 mil, 5.30mm), 28-lead
ML = Plastic Quad, Flat No Leads (QFN), 28-lead
Examples:
a) DSTEMP-I/P: Industrial Temperature,
PDIP package.
a) DSTEMP-I/SO: Industrial Temperature,
SOIC package.
a) DSTEMP-I/SS: Industrial Temperature,
SOIC package.
a) DSTEMP-I/ML: Industrial Temperature,
QFN package.