Datasheet
Table Of Contents
- Features
- CMOS Technology
- Packages
- Package Types
- Block Diagram
- 1.0 Device OvervieW
- 1.1 Pin Descriptions
- 1.2 Power-on Reset (POR)
- 1.3 Power-up Timer (PWRT)
- 1.4 Clock Generator
- 1.5 I2C Bus Interface/ Protocol Handler
- 1.6 Address Decoder
- 1.7 Register Block
- 1.8 Serializer/Deserializer
- 1.9 Interrupt Logic
- 2.0 Electrical Characteristics
- 2.1 DC Characteristics
- TABLE 2-1: DC Characteristics
- FIGURE 2-1: respOnse time
- TABLE 2-2: response time
- FIGURE 2-2: TEST POINT Clock Timing
- TABLE 2-3: TEST POINT Clock Timing
- TABLE 2-4: Power-up Timer Requirements
- FIGURE 2-3: I2C Bus Start/Stop Bits Timing
- FIGURE 2-4: I2C Bus Data Timing
- TABLE 2-5: I2C Bus Data Requirements
- FIGURE 2-5: GP0 and GP1 POrt Timings
- 2.1 DC Characteristics
- 3.0 Package InFormation
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS20090C-page 31
MCP23016
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
w
ith 0.55 mm Contact Length
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Package is saw singulated.
3
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 28
Pitch e 0.65 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 6.00 BSC
Exposed Pad Width E2 3.65 3.70 4.20
Overall Length D 6.00 BSC
Exposed Pad Length D2 3.65 3.70 4.20
Contact Width b 0.23 0.30 0.35
Contact Length L 0.50 0.55 0.70
Contact-to-Exposed Pad K 0.20 – –
D
EXPOSED
D2
e
b
K
E2
E
L
N
NOTE 1
1
2
2
1
N
A
A1
A3
TOP VIEW
BOTTOM VIEW
PAD
Microchip Technology Drawing C04-105
B