Datasheet
Table Of Contents
- Features
- CMOS Technology
- Packages
- Package Types
- Block Diagram
- 1.0 Device OvervieW
- 1.1 Pin Descriptions
- 1.2 Power-on Reset (POR)
- 1.3 Power-up Timer (PWRT)
- 1.4 Clock Generator
- 1.5 I2C Bus Interface/ Protocol Handler
- 1.6 Address Decoder
- 1.7 Register Block
- 1.8 Serializer/Deserializer
- 1.9 Interrupt Logic
- 2.0 Electrical Characteristics
- 2.1 DC Characteristics
- TABLE 2-1: DC Characteristics
- FIGURE 2-1: respOnse time
- TABLE 2-2: response time
- FIGURE 2-2: TEST POINT Clock Timing
- TABLE 2-3: TEST POINT Clock Timing
- TABLE 2-4: Power-up Timer Requirements
- FIGURE 2-3: I2C Bus Start/Stop Bits Timing
- FIGURE 2-4: I2C Bus Data Timing
- TABLE 2-5: I2C Bus Data Requirements
- FIGURE 2-5: GP0 and GP1 POrt Timings
- 2.1 DC Characteristics
- 3.0 Package InFormation
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
MCP23016
DS20090C-page 30 © 2007 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 28
Pitch e 0.65 BSC
Overall Height A – – 2.00
Molded Package Thickness A2 1.65 1.75 1.85
Standoff A1 0.05 – –
Overall Width E 7.40 7.80 8.20
Molded Package Width E1 5.00 5.30 5.60
Overall Length D 9.90 10.20 10.50
Foot Length L 0.55 0.75 0.95
Footprint L1 1.25 REF
Lead Thickness c 0.09 – 0.25
Foot Angle φ 0° 4° 8°
Lead Width b 0.22 – 0.38
L
L1
c
A2
A1
A
E
E1
D
N
1
2
NOTE 1
b
e
φ
Microchip Technology Drawing C04-073
B