Datasheet
Table Of Contents
- Features
- CMOS Technology
- Packages
- Package Types
- Block Diagram
- 1.0 Device OvervieW
- 1.1 Pin Descriptions
- 1.2 Power-on Reset (POR)
- 1.3 Power-up Timer (PWRT)
- 1.4 Clock Generator
- 1.5 I2C Bus Interface/ Protocol Handler
- 1.6 Address Decoder
- 1.7 Register Block
- 1.8 Serializer/Deserializer
- 1.9 Interrupt Logic
- 2.0 Electrical Characteristics
- 2.1 DC Characteristics
- TABLE 2-1: DC Characteristics
- FIGURE 2-1: respOnse time
- TABLE 2-2: response time
- FIGURE 2-2: TEST POINT Clock Timing
- TABLE 2-3: TEST POINT Clock Timing
- TABLE 2-4: Power-up Timer Requirements
- FIGURE 2-3: I2C Bus Start/Stop Bits Timing
- FIGURE 2-4: I2C Bus Data Timing
- TABLE 2-5: I2C Bus Data Requirements
- FIGURE 2-5: GP0 and GP1 POrt Timings
- 2.1 DC Characteristics
- 3.0 Package InFormation
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
MCP23016
DS20090C-page 28 © 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. § Significant Characteristic.
3
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 28
Pitch e .100 BSC
Top to Seating Plane A – – .200
Molded Package Thickness A2 .120 .135 .150
Base to Seating Plane A1 .015 – –
Shoulder to Shoulder Width E .290 .310 .335
Molded Package Width E1 .240 .285 .295
Overall Length D 1.345 1.365 1.400
Tip to Seating Plane L .110 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .050 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB – – .430
NOTE 1
N
12
D
E1
eB
c
E
L
A2
eb
b1
A1
A
3