Datasheet
Table Of Contents
- Features
- CMOS Technology
- Packages
- Package Types
- Block Diagram
- 1.0 Device OvervieW
- 1.1 Pin Descriptions
- 1.2 Power-on Reset (POR)
- 1.3 Power-up Timer (PWRT)
- 1.4 Clock Generator
- 1.5 I2C Bus Interface/ Protocol Handler
- 1.6 Address Decoder
- 1.7 Register Block
- 1.8 Serializer/Deserializer
- 1.9 Interrupt Logic
- 2.0 Electrical Characteristics
- 2.1 DC Characteristics
- TABLE 2-1: DC Characteristics
- FIGURE 2-1: respOnse time
- TABLE 2-2: response time
- FIGURE 2-2: TEST POINT Clock Timing
- TABLE 2-3: TEST POINT Clock Timing
- TABLE 2-4: Power-up Timer Requirements
- FIGURE 2-3: I2C Bus Start/Stop Bits Timing
- FIGURE 2-4: I2C Bus Data Timing
- TABLE 2-5: I2C Bus Data Requirements
- FIGURE 2-5: GP0 and GP1 POrt Timings
- 2.1 DC Characteristics
- 3.0 Package InFormation
- Appendix A: Revision History
- Product Identification System
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS20090C-page 19
MCP23016
2.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Ambient temperature under bias................................................................................................................ -55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
SS ......................................................................................... -0.3V to (VDD + 0.3V)
Voltage on V
DD with respect to VSS ......................................................................................................... -0.3V to +6.5V
Total power dissipation (Note 1) ............................................................................................................................ 1.0 W
Maximum current out of V
SS pin .......................................................................................................................... 300 mA
Maximum current into V
DD pin ............................................................................................................................. 250 mA
Input clamp current, I
IK (VI < 0, or VI > VDD)....................................................................................................... ± 20 mA
Output clamp current, I
OK (VO < 0, or VO > VDD) ................................................................................................ ± 20 mA
Maximum output current sunk by any I/O pin......................................................................................................... 25 mA
Maximum output current sourced by any I/O pin ................................................................................................... 25 mA
Maximum current sunk by combined PORTS...................................................................................................... 200 mA
Maximum current sourced by combined PORTS ................................................................................................ 200 mA
Note 1: Power dissipation is calculated as follows:
Pdis = V
DD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.