Datasheet

© 2009 Microchip Technology Inc. DS22121B-page 39
MCP23009/MCP23S09
3.0 PACKAGING INFORMATION
3.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
18-Lead PDIP (300 mil) Example:
18-Lead SOIC (300 mil) Example:
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXX
MCP23009
0919256
E/P^^
3
e
XXXXXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXXXXXX
MCP23009
E/SO^^
256
0919
3
e
YYWWNNN
XXXXXXXXXXX
XXXXXXXXXXX
MCP23009
E/SS^^
3
e
0919
256
20-Lead SSOP (300 mil) Example:
16-Lead QFN (3x3 mm)
Example
XXX
EYWW
NNN
239
E919
256