Datasheet

MCP23009/MCP23S09
DS22121B-page 2 © 2009 Microchip Technology Inc.
Package Types:
Package Types:
MCP23009
PDIP/SOIC QFN
VSS18
NC17
NC16
GP715
GP614
GP513
GP412
GP210
VDD 1
N/C 2
SCL 3
SDA 4
ADDR 5
RESET 6
INT 7
GP0 8 GP311
GP1 9
GP6 15 GP7 16
VSS 1
VDD
2
NC
3
SCL 4
SDA 5
ADDR 6
RESET 7
GP312
GP211
GP110
GP09
INT 8
GP5 14 GP4 13
EP
17
VSS
20
NC
19
NC
18
GP7
17
GP6
16
GP5
15
GP4
14
GP3
13
GP2
12
NC
11
VDD 1
NC 2
SCL 3
SDA 4
ADDR 5
RESET 6
INT 7
GP0 8
GP1 9
NC 10
SSOP
* Includes Exposed Thermal Pad (EP); see Table 1-1 and.Table 1-2
MCP23S09
PDIP/SOIC QFN *
VSS18
NC17
GP716
GP615
GP514
GP413
GP312
GP110
VDD 1
NC 2
CS 3
SCK 4
SI 5
SO 6
RESET 7
INT 8 GP211
GP0 9
GP6 15 GP7 16
VSS 1
SCK 2
VDD 3
CS 4
SI 5
SO 6
RESET 7
GP312
GP211
GP110
GP09
INT 8
GP5 14 GP4 13
EP
17
* Includes Exposed Thermal Pad (EP); see Table 1-1 and.Table 1-2