Datasheet

MCP2200
DS22228B-page 28  2011 Microchip Technology Inc.
TABLE 3-2: THERMAL CONSIDERATIONS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C  T
A  +85C (I-Temp)
Param
No.
Sym Characteristic Typ Units Conditions
TH01 θ
JA Thermal Resistance Junction to
Ambient
85.2 C/W 20-pin SOIC package
108.1 C/W 20-pin SSOP package
36.1 C/W 20-pin QFN 5x5 mm package
TH02 θ
JC Thermal Resistance Junction to
Case
24 C/W 20-pin SOIC package
24 C/W 20-pin SSOP package
1.7 C/W 20-pin QFN 5x5 mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD –
V
OH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/θJA
(2,3)
Note 1: IDD is the current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: TJ = Junction Temperature.