Information

Bill Of Materials (BOM)
© 2009 Microchip Technology Inc. DS51842A-page 43
TABLE B-2: TABLE OF CONTENTS (BOM) – PCB COMPONENTS NOT INSTALLED
Qty Reference Description Manufacturer Part Number
0 C4 CAP .47UF 16V CERAMIC X7R 080 Panasonic - ECG ECJ-2YB1C474K
0 C5 AP TANTALUM 6.8UF 16V 20% SMD Nichicon
®
Corporation
F931C685MAA
0 C6 CAP 4.7UF 16V CERAMIC F 0805 Panasonic - ECG ECJ-2FF1C475Z
0 C7 CAP .1UF 25V CERAMIC X7R 0805 Panasonic - ECG ECJ-2VB1C104K
0 C14, C15 CAP CERAMIC 22PF 50V NP0 0805 Kemet
®
Electronics
Corp.
C0805C220J5GACTU
0 JP1A1, JP1B1,
JP2A1, JP2B1
CONN HEADER 2POS .100 VERT TIN Molex/Waldom
Electronics Corp.
22-03-2021
0 HD1 CONN HEADER 12POS .100 VERT TIN Molex/Waldom
Electronics Corp.
22-28-4120
0 JMP6 CONN HEADER 16POS .100 VERT
GOLD
Molex/Waldom
Electronics Corp.
10-89-1161
0 R1 RES 2.2 OHM 1/8W 1% 0805 SMD Panasonic - ECG ERJ-6RQF2R2V
0 R3, R4, R5 RES 0.0 OHM 1/8W 5% 0805 SMD Panasonic - ECG ERJ-6GEY0R00V
0 U1 IRDA MODULE 115.2KBPS 6-SMD LITE-ON
Semiconductor Corp.
HSDL-3000#007
0 U3 Infrared Transceivers SIR 115.2 kbits/s Vishay
®
TFDU4101-TR3
0 U7 IC SOCKET 18PIN MS TIN/TIN .300 Mill-Max
Manufacturing Corp.
110-99-318-41-001000
0 U8 MCP2120 in SOIC Microchip Technology
Inc.
MCP2120-I/SL
0 U10 MCP2122 in SOIC Microchip Technology
Inc.
MCP2122-I/SL
0 Y2 CRYSTAL 3.6864 MHZ 20PF 49US ECS Inc. ECS-36-20-4DN
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The
released BOM used in manufacturing uses all RoHS-compliant components.