Information

MCP2120/22 DEVELOPER’S BOARD
USER’S GUIDE
© 2009 Microchip Technology Inc. DS51842A-page 33
Appendix A. Schematic and Layouts
A.1 INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2120/22
Developer’s Board:
• Board - Schematic
• Board - Top Silk and Pads
• Board - Top layer plus Silk and Pads
• Board - Bottom Layer
•Board - V
DD Layer
• Board - Ground Layer
The layer order is shown in Figure A-1.
FIGURE A-1: LAYER ORDER
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some schematics and
board layouts may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Top Layer
Ground Layer
Power Layer
Bottom Layer