Information

MCP2120/22 DEVELOPER’S BOARD
USER’S GUIDE
© 2009 Microchip Technology Inc. DS51842A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 2
Conventions Used in this Guide............................................................................ 3
Recommended Reading........................................................................................ 4
The Microchip Web Site ........................................................................................ 4
Customer Support ................................................................................................. 4
Document Revision History................................................................................... 4
Chapter 1. Product Overview ....................................................................................... 5
1.1 Introduction And Highlights ............................................................................ 5
1.2 What is the MCP2120/22 Developer’s Board? ............................................... 5
1.3 MCP2120/22 Developer’s Board Features ..................................................... 6
1.4 PC Requirements ......................................................................................... 14
1.5 What the MCP2120/22 Developer’s Board Kit includes: .............................. 14
Chapter 2. Installation and Operation ....................................................................... 15
2.1 Introduction ................................................................................................... 15
2.2 The Demo System ........................................................................................ 16
2.3 MCP212XDM Demos ................................................................................... 20
Appendix A. Schematic and Layouts ........................................................................ 33
A.1 Introduction .................................................................................................. 33
A.2 Board - Schematic ....................................................................................... 34
A.3 Board - Top Silk and Pads ........................................................................ 35
A.4 Board - Top Layer plus Silk and Pads ...................................................... 36
A.5 Board - Bottom Layer ................................................................................. 37
A.6 Board - Power Layer ................................................................................... 38
A.7 Board - Ground Layer ................................................................................ 39
Appendix B. Bill Of Materials (BOM) ......................................................................... 41
Appendix C. Board Testing ........................................................................................ 45
C.1 What is Tested ............................................................................................. 45
C.2 What is NOT Tested .................................................................................... 45
Appendix D. Configuring the HyperTerminal
®
Program ......................................... 47
D.1 Configuring the Hyperterminal® Program .................................................... 47
Appendix E. Continously Transmitted Data Table ................................................... 51
Appendix F. Programming the MCP212XDM ............................................................ 53
Worldwide Sales and Service .................................................................................... 54