MCP2120 Infrared Encoder/Decoder Features Pin Diagrams ® CMOS Technology • • • • • Low-power, high-speed CMOS technology Fully static design Low voltage operation Commercial and Industrial temperature ranges Low power consumption - < 1 mA @ 3.3V, 8 MHz (typical) - 3 mA typical @ 5.
MCP2120 NOTES: DS21618B-page 2 © 2007 Microchip Technology Inc.
MCP2120 1.0 DEVICE OVERVIEW 1.1 This document contains device specific information for the following device: • MCP2120 This device is a low-cost, high-performance, fully-static infrared encoder/decoder. This device sits between a UART and an infrared (IR) optical transceiver. The data received from a standard UART is encoded (modulated), and output as electrical pulses to the IR Transceiver. The IR Transceiver also receives data which it outputs as electrical pulses.
MCP2120 TABLE 1-2: PIN DESCRIPTION USER MODE Pin Number PDIP SOIC Pin Type VDD 1 1 — OSC1/CLKIN 2 2 I Pin Name Buffer Type P Description Positive supply for logic and I/O pins CMOS Oscillator crystal input/external clock source input OSC2 3 3 O — Oscillator crystal Output RESET 4 4 I ST Resets the Device RXIR 5 5 I ST Asynchronous receive from infrared transceiver TXIR 6 6 O — Asynchronous transmit to infrared transceiver MODE 7 7 I TTL Selects the device mode (D
MCP2120 2.0 DEVICE OPERATION 2.4 UART Interface The MCP2120 is a low cost infrared Encoder/Decoder. The baud rate is user selectable to standard IrDA baud rates between 9600 baud to 115.2 kbaud. The maximum baud rate is 312.5 kbaud. The UART interface communicates with the "controller". This interface is a Half duplex interface, meaning that the system is either transmitting or receiving, but not both at the same time. 2.1 2.4.
MCP2120 2.4.1.2 Software Selection 2.4.3 RECEIVING When the BAUD2:BAUD0 pins are configured as ’111’ the MCP2120 defaults to a baud rate of FOSC / 768. When the controller receives serial data from the MCP2120, the baud rates are required to match. To place the MCP2120 into Command Mode, the MODE pin must be at a low level. When in this mode, any data that is received by the MCP2120’s UART is "echoed" back to the controller and no encoding/ decoding occurs.
MCP2120 2.5 Modulation 2.6 When the UART receives data to be transmitted, the data needs to be modulated. This modulated signal drives the IR transceiver module. Figure 2-2 shows the encoding of the modulated signal. The modulated signal from the IR transceiver module needs to be demodulated to form the received data. As demodulation occurs, the bit value is placed on the RX pin in UART format. Figure 2-3 shows the decoding of the modulated signal. Each bit time is comprised of 16-bit clocks.
MCP2120 2.7 Encoding/Decoding Jitter and Offset 2.8 The device can be placed in a low power mode by disabling the device (holding the EN pin at the low state). The internal state machine is monitoring this pin for a low level, and once this is detected the device is disabled and enters into a low power state. Figure 2-4 shows the jitter and offset that is possible on the RX pin and the TXIR pin. Jitter is the possible variation of the desired edge.
MCP2120 3.0 DEVELOPMENT TOOLS The MCP212X Developer’s Daughter Board is used to evaluate and demonstrate the MCP2122 or the MCP2120 IrDA® Standard Encoder/Decoder devices. The MCP2120/MCP2150 Developer’s Kit has been obsoleted but if you have access to one of these kits, it can be used to demonstrate the operation of the MCP2120. A header allows the MCP212X Developer’s Daughter Board to be jumpered easily into systems for development purposes.
MCP2120 NOTES: DS21618B-page 10 © 2007 Microchip Technology Inc.
MCP2120 4.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Ambient Temperature under bias ........................................................................................................... –40°C to +125°C Storage Temperature ............................................................................................................................. –65°C to +150°C Voltage on VDD with respect to VSS .............................................................................................
MCP2120 Voltage-Frequency Graph, -40°C ≤ TA ≤ +85°C FIGURE 4-1: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 8 10 12 16 20 Frequency (MHz) FMAX = (8.0 MHz/V) (VDDAPPMIN -2.5V) + 4 MHz Note: VDDAPPMIN is the minimum voltage of the MCP2120 in the application. DS21618B-page 12 © 2007 Microchip Technology Inc.
MCP2120 4.1 DC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) DC Characteristics Param. No. Sym D001 VDD D002 Min Typ(1) Max Units Supply Voltage 2.5 — 5.5 V See Figure 4-1 VDR RAM Data Retention Voltage (2) 2.5 — — V Device Oscillator/Clock stopped D003 VPOR VDD Start Voltage to ensure Power-on Reset — VSS — V D004 SVDD VDD Rise Rate to ensure Power-on Reset 0.
MCP2120 DC Characteristics (Continued) DC CHARACTERISTICS Param No. Sym Characteristic Standard Operating Conditions (unless otherwise specified) Operating temperature –40°C ≤ TA ≤ +85°C (industrial) Operating voltage VDD range as described in DC spec Section 4.1 “DC Characteristics”. Min Typ Max Units Vss Vss Conditions — 0.8V V For all 4.5 ≤ VDD ≤ 5.5V — 0.15VDD V otherwise Input Low Voltage VIL D030 Input pins with TTL buffer D030A D031 with Schmitt Trigger buffer VSS — 0.
MCP2120 DC Characteristics (Continued) Standard Operating Conditions (unless otherwise specified) Operating temperature –40°C ≤ TA ≤ +85°C (industrial) Operating voltage VDD range as described in DC spec Section 4.1 “DC Characteristics” DC CHARACTERISTICS Param No. Sym D080 VOL Min Typ Max Units Output Low Voltage TXIR, RX — — 0.6 V OSC2 — — 0.6 V Output High Voltage TXIR, RX (1) VDD - 0.7 — — V OSC2 VDD - 0.
MCP2120 4.2 Timing Parameter Symbology and Load Conditions The timing parameter symbols have been created following one of the following formats: 4.2.1 TIMING CONDITIONS The temperature and voltages specified in Table 4-2 apply to all timing specifications unless otherwise noted. Figure 42 specifies the load conditions for the timing specifications. TABLE 4-1: SYMBOLOGY 1.
MCP2120 4.3 Timing Diagrams and Specifications FIGURE 4-3: External Clock Timing Q4 Q1 Q3 Q2 Q4 Q1 OSC1 1 TABLE 4-3: 1 Sym 3 4 4 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-4: I/O Waveform Q1 Q4 Q2 Q3 OSC1 Input Pin 17 Output Pin 19 18 New Value Old Value 20, 21 Note: TABLE 4-4: Refer to Figure 4-2 for load conditions. I/O TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-5: Reset and Device Reset Timer Timing VDD RESET 30 32 32 32 DRT Time-out Internal RESET Low Power Timer Reset 31 34 34 Output pin TABLE 4-5: RESET AND DEVICE RESET TIMER REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-6: USART ASynchronous Transmission Waveform Start Bit Data Bit IR100 IR100 Data Bit Data Bit IR100 IR100 TX pin IR103 IR103 Note: Refer to Figure 4-2 for load conditions. TABLE 4-6: USART ASYNCHRONOUS TRANSMISSION REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-7: USART ASynchronous Receive Timing Start Bit Data Bit Data Bit Data Bit IR110 IR110 IR110 IR110 RX pin IR112 IR112 Note: TABLE 4-7: Refer to Figure 4-2 for load conditions. USART ASYNCHRONOUS RECEIVE REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-8: TX and TXIR Waveforms Start Bit Data bit 7 Data bit 6 Data bit 5 Data bit ... IR100 BITCLK TX IR122 IR122 IR122 IR122 IR122 IR122 IR120 TXIR IR121 0 TABLE 4-8: 1 0 1 0 TX AND TXIR REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-9: RXIR and RX Waveforms Start Bit Data bit 7 Data bit 6 Data bit 5 Data bit ... IR110 BITCLK RXIR IR131A IR130 IR131B IR131B 0 Start Bit 1 Data bit 7 IR131B IR131B IR131B IR131B 0 Data bit 5 1 Data bit ... 0 RX TABLE 4-9: 0 Data bit 6 RXIR REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +85°C (industrial) Operating Voltage VDD range is described in Section 4.1 “DC Characteristics” AC Characteristics Param. No.
MCP2120 FIGURE 4-10: Command Mode: TX and RX Waveforms Start Bit Data bit 7 Data bit 6 IR140A IR140A IR140A Data bit ...
MCP2120 5.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented is outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time.
MCP2120 FIGURE 5-2: IOH vs. VOH, VDD = 2.5V FIGURE 5-4: IOL vs. VOL, VDD = 2.5V 25 0 -1 20 Max –40°C 15 -3 IOL (mA) IOH (mA) -2 -4 Typ +25°C 10 -5 -6 Min +85°C 85°C Min + 5 5°C Typ +2 40°C Max – -7 500m 1.0 1.5 2.0 2.5 0 VOH (Volts) 0 250.0m 500.0m 1.0 VOL (Volts) FIGURE 5-3: IOH vs. VOH, VDD = 5.5V FIGURE 5-1: 0 IOL vs. VOL, VDD = 5.5V 50 -5 Max –40°C 40 Typ +25°C 30 -20 -25 IOL (mA) -15 -30 3.5 4.
MCP2120 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 14-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 14-Lead SOIC (150 mil) XXXXXXX XXXXXXX YYWWNNN Legend: XX...
MCP2120 14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 3 2 D E A2 A L A1 c b1 b e eB Units Dimension Limits Number of Pins INCHES MIN N NOM MAX 14 Pitch e Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .290 .310 .
MCP2120 14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 3 e h b A A2 c φ L A1 β L1 Units Dimension Limits Number of Pins α h MILLMETERS MIN N NOM MAX 14 Pitch e Overall Height A – 1.27 BSC – Molded Package Thickness A2 1.25 – – Standoff § A1 0.10 – 0.
MCP2120 FIGURE 6-1: EMBOSSED CARRIER DIMENSIONS (16 MM TAPE) Top Cover Tape A0 W B0 K0 P TABLE 6-1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline Carrier Dimensions Package Type SL SOIC .150” FIGURE 6-2: 14L Cavity Dimensions W mm P mm A0 mm B0 mm K0 mm 16 8 6.5 9.5 2.
MCP2120 APPENDIX A: REVISION HISTORY Revision B (February 2007) • Updated Development Tools section • Update packaging outline drawings • Updates Product Identification System section. Revision A (March 2001) • Initial release of this document © 2007 Microchip Technology Inc.
NOTES: DS21618B-page 32 © 2007 Microchip Technology Inc.
MCP2120 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Examples: a) b) c) Device MCP2120: Infrared Encoder/Decoder MCP2120T: Infrared Encoder/Decoder, Tape and Reel Temperature Range I = -40×C to+85×C Package P SL = Plastic DIP (300 mil, Body), 14-lead = Plastic SOIC (150 mil, Body), 14-lead © 2007 Microchip Technology Inc.
MCP2120 NOTES: DS21618B-page 34 © 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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