Datasheet

MCP2003/4/3A/4A
DS20002230E-page 16  2010-2013 Microchip Technology Inc.
2.5 Thermal Specifications
THERMAL CHARACTERISTICS
Parameter Symbol Typ Max Units Test Conditions
Recovery Temperature 
RECOVERY +140
—
C
Shutdown Temperature SHUTDOWN +150
—
C
Short Circuit Recovery Time t
THERM 1.5 5.0 ms
Thermal Package Resistances
Thermal Resistance, 8L-DFN JA 35.7 — C/W
Thermal Resistance, 8L-PDIP 
JA 89.3 — C/W
Thermal Resistance, 8L-SOIC JA 149.5 — C/W
Note 1: The maximum power dissipation is a function of TJMAX, JA and ambient temperature T
A
. The maximum
allowable power dissipation at an ambient temperature is P
D = (TJMAX - TA)JA. If this dissipation is
exceeded, the die temperature will rise above 150C and the device will go into thermal shutdown.