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 2010-2013 Microchip Technology Inc. DS20002230E-page 1

MCP2003/4/3A/4A

Features:

• The MCP2003/2003A and MCP2004/2004A are

compliant with Local Interconnect Network (LIN)

Bus Specifications 1.3, 2.0 and 2.1 and are

compliant to SAE J2602

• Support Baud Rates up to 20 Kbaudwith

LIN-compatible output driver

• 43V load dump protected

• Very low EMI meets stringent OEM requirements

• Very high ESD immunity:

->20kV on V

BB (IEC 61000-4-2)

->14kV on LBUS (IEC 61000-4-2)

• Very high immunity to RF disturbances meets

stringent OEM requirements

• Wide supply voltage, 6.0V-27.0V continuous

• Extended Temperature Range: -40 to +125°C

• Interface to PIC

MCU EUSART and standard

USARTs

• LIN bus pin:

- Internal pull-up resistor and diode

- Protected against battery shorts

- Protected against loss of ground

- High current drive

• Automatic thermal shutdown

• Low-power mode:

- Receiver monitoring bus and transmitter off,

( 5µA)

Description:

This device provides a bidirectional, half-duplex

communication, physical interface to automotive and

industrial LIN systems to meet the LIN bus specification

Revision 2.1 and SAE J2602. The device is short-

circuit and over-temperature protected by internal

circuitry. The device has been specifically designed to

operate in the automotive operating environment and

will survive all specified transient conditions while

meeting all of the stringent quiescent current

requirements.

MCP200X family members:

• 8-pin PDIP, DFN and SOIC packages:

- MCP2003, LIN-compatible driver, with WAKE

pins, wake up on falling edge of L

BUS

- MCP2003A, LIN-compatible driver, with

WAKE

pins, wake up on rising edge of LBUS

- MCP2004, LIN-compatible driver, with

FAULT

/TXE pins, wake up on falling edge of

BUS

- MCP2004A, LIN-compatible driver, with

FAULT

/TXE pins, wake up on rising edge of

BUS

Package Types

MCP2004/

2004A

PDIP, SOIC

FAULT/TXE

CS/WAKE

VBB

LBUS

VSS

VRENRXD

MCP2003/

2003A

PDIP, SOIC

WAKE

VBB

LBUS

VSS

VRENRXD

MCP2003/

2003A

4x4 DFN*

WAKE

VBB

LBUS

VSS

VRENRXD

MCP2004/

2004A

4x4 DFN*

FAULT/TXE

CS/WAKE

TXD

VBB

LBUS

VSS

VRENRXD

* Includes Exposed Thermal Pad (EP); see Table 1-1.

LIN J2602 Transceiver

Summary of content (34 pages)

PAGE 1
MCP2003/4/3A/4A LIN J2602 Transceiver Features: Description: • The MCP2003/2003A and MCP2004/2004A are compliant with Local Interconnect Network (LIN) Bus Specifications 1.3, 2.0 and 2.
PAGE 2
MCP2003/4/3A/4A MCP2003/2003A Block Diagram VBB VREN Ratiometric Reference Wake-Up Logic and Power Control 4.3V WAKE RXD CS ~30 k TXD LBUS OC VSS Thermal Protection Short Circuit Protection MCP2004/2004A Block Diagram VBB VREN 4.3V 4.3V Ratiometric Reference Wake-Up Logic and Power Control RXD CS/WAKE TXD ~30 k OC LBUS FAULT/TXE VSS Thermal Protection DS20002230E-page 2 Short Circuit Protection  2010-2013 Microchip Technology Inc.
PAGE 3
MCP2003/4/3A/4A 1.0 DEVICE OVERVIEW 1.2.3 THERMAL PROTECTION The MCP2003/4/3A/4A devices provide a physical interface between a microcontroller and a LIN bus. These devices will translate the CMOS/TTL logic levels to LIN logic level, and vice versa. It is intended for automotive and industrial applications with serial bus speeds up to 20 Kbaud. The thermal protection circuit monitors the die temperature and is able to shut down the LIN transmitter. LIN specification 2.
PAGE 4
MCP2003/4/3A/4A 1.3 Modes of Operation Upon VBB supply pin power-on, the device will remain in Ready mode as long as CS is low. When CS transitions high, the device will either enter Operation mode, if TXD pin is held high, or the device will enter Transmitter Off mode, if TXD pin is held low. For an overview of all operational modes, refer to Table 1-1. 1.3.1 POWER-DOWN MODE In Power-Down mode, everything is off except the wake-up section. This is the lowest power mode.
PAGE 5
MCP2003/4/3A/4A FIGURE 1-3: OPERATIONAL MODES STATE DIAGRAM – MCP2003A POR VREN OFF RX OFF TX OFF VBAT>5.5V Ready VREN ON RX OFF TX OFF CS=1 & TXD=1 CS=1 & TXD=0 TOFF Mode VREN ON RX ON TX OFF Rising edge on LIN or CS=1 Or falling edge on WAKE PIN CS=1 & TXD=1 & No Fault Fault (thermal or timer) Operation Mode VREN ON RX ON TX ON CS=0 CS=0 POWER DOWN VREN OFF RX OFF TX OFF FIGURE 1-4: OPERATIONAL MODES STATE DIAGRAM – MCP2004 POR VREN OFF RX OFF TX OFF VBAT>5.
PAGE 6
MCP2003/4/3A/4A FIGURE 1-5: OPERATIONAL MODES STATE DIAGRAM – MCP2004A POR VREN OFF RX OFF TX OFF Ready VREN ON RX ON TX OFF VBAT>5.
PAGE 7
MCP2003/4/3A/4A 1.4 Typical Applications EXAMPLE 1-1: TYPICAL MCP2003/2003A APPLICATION +12 optional resistor and transient suppressor +12 50W 43V 1.0 µF (See Note) Master Node Only +12 3.9 KW Voltage Reg VDD VREN VBB 4.7 KW TXD TXD RXD RXD I/O CS 1 KW LIN Bus LBUS 43V WAKE Wake-up Note: VSS For applications with current requirements of less than 20 mA, the connection to +12V can be deleted, and voltage to the regulator supplied directly from the VREN pin.
PAGE 8
MCP2003/4/3A/4A EXAMPLE 1-3: TYPICAL LIN NETWORK CONFIGURATION 40m + Return LIN bus 1 k VBB LIN bus MCP200X LIN bus MCP200X Slave 1 µC LIN bus MCP200X LIN bus MCP200X Slave 2 µC Slave n <23 µC Master µC DS20002230E-page 8  2010-2013 Microchip Technology Inc.
PAGE 9
MCP2003/4/3A/4A 1.
PAGE 10
MCP2003/4/3A/4A The WAKE pin has an internal 800K pull up to VBB. A falling edge on the WAKE pin causes the device to wake from Power-Down mode. Upon waking, the MCP2003/3A will enter Ready mode. 1.5.4 TXE Truth Table”. The transmitter is disabled whenever this pin is low (‘0’), either from an internal Fault condition or by an external drive. While the transmitter is disabled, the internal 30 k pull-up resistor on the LBUS pin is also disconnected to reduce current.
PAGE 11
MCP2003/4/3A/4A 1.5.10 EXPOSED THERMAL PAD (EP) Do not electrically connect, or connect to Vss. 1.6 MCP2003/4 and MCP2003A/4A Difference Details The differences between the MCP2003/4 and the MCP2003/4A devices are isolated to the wake-up functionality. The changes were implemented to make the device more robust to LIN bus conditions, outside of the normal operating conditions. The MCP2003/4 will wake-up from Power Down mode during any LIN falling edge held low longer than 20 µs.
PAGE 12
MCP2003/4/3A/4A 2.0 ELECTRICAL CHARACTERISTICS 2.1 Absolute Maximum Ratings† VIN DC Voltage on RXD, TXD, FAULT/TXE, CS ............................................................................................. -0.3 to +43V VIN DC Voltage on WAKE and VREN .............................................................................................................-0.3 to +VBB VBB Battery Voltage, continuous, non-operating (Note 1).........................................................................
PAGE 13
MCP2003/4/3A/4A 2.3 DC Specifications DC Specifications Parameter Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VBB = 6.0V to 30.0V TA = -40°C to +125°C Sym Min. Typ. Max.
PAGE 14
MCP2003/4/3A/4A 2.3 DC Specifications (Continued) DC Specifications Parameter Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VBB = 6.0V to 30.0V TA = -40°C to +125°C Sym Min. Typ. Max. Units Conditions High-Level Input Voltage VIH(LBUS) 0.6 VBB — — V Recessive state Low-Level Input Voltage VIL(LBUS) -8 — 0.4 VBB V Dominant state VHYS — — 0.
PAGE 15
MCP2003/4/3A/4A 2.4 AC Specifications AC CHARACTERISTICS VBB = 6.0V to 27.0V; TA = -40°C to +125°C Parameter Sym Min. Typ. Max. Units Test Conditions Bus Interface – Constant Slope Time Parameters tSLOPE 3.5 — 22.5 µs 7.3V <= VBB <= 18V tTRANSPD — — 4.0 µs tTRANSPD = max (tTRANSPDR or tTRANSPDF) Propagation Delay of Receiver tRECPD — — 6.0 µs tRECPD = max (tRECPDR or tRECPDF) Symmetry of Propagation Delay of Receiver Rising Edge w.r.t. Falling Edge tRECSYM -2.0 — 2.
PAGE 16
MCP2003/4/3A/4A 2.5 Thermal Specifications THERMAL CHARACTERISTICS Parameter Symbol Typ Max Units Recovery Temperature RECOVERY +140 — C Shutdown Temperature SHUTDOWN +150 — C tTHERM 1.5 5.0 ms Short Circuit Recovery Time Test Conditions Thermal Package Resistances Thermal Resistance, 8L-DFN JA 35.7 — C/W Thermal Resistance, 8L-PDIP JA 89.3 — C/W Thermal Resistance, 8L-SOIC JA 149.
PAGE 17
MCP2003/4/3A/4A 2.6 Typical Performance Curves Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
PAGE 18
MCP2003/4/3A/4A 2.7 Timing Diagrams and Specifications FIGURE 2-4: BUS TIMING DIAGRAM TXD 50% 50% LBUS .95VLBUS .50VBB 0.05VLBUS TTRANSPDR TTRANSPDF TRECPDF 0.0V TRECPDR RXD 50% Internal TXD/RXD Compare Match 50% Match Match Match Match FAULT Sampling TFAULT TFAULT FAULT/TXE Output Stable FIGURE 2-5: CS Hold Value Stable Hold Value Stable CS TO VREN TIMING DIAGRAM TCSOR VBB VREN OFF TCSPD DS20002230E-page 18  2010-2013 Microchip Technology Inc.
PAGE 19
MCP2003/4/3A/4A FIGURE 2-6: MCP2003/4 REMOTE WAKE-UP FIGURE 2-7: MCP2003A/4A REMOTE WAKE-UP  2010-2013 Microchip Technology Inc.
PAGE 20
MCP2003/4/3A/4A 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 8-Lead DFN (4x4) Examples: XXXX YYWW NNN 2004A E/MD^^e3 1328 256 2004 e3 E/MD^^ 1328 256 PIN 1 8-Lead PDIP (300 mil) Examples: MCP2003A e3 E/P^^256 1328 XXXXXXXX XXXXXNNN MCP2003 e3 E/P^^256 1328 YYWW 8-Lead SOIC (150 mil) MCP2003E e3 SN^^1328 256 NNN Legend: XX...
PAGE 21
MCP2003/4/3A/4A 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-131E Sheet 1 of 2  2010-2013 Microchip Technology Inc.
PAGE 22
MCP2003/4/3A/4A 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-131E Sheet 2 of 2 DS20002230E-page 22  2010-2013 Microchip Technology Inc.
PAGE 23
MCP2003/4/3A/4A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010-2013 Microchip Technology Inc.
PAGE 24
MCP2003/4/3A/4A 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4 N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 6 &! ' ! 9 ' &! 7"') % ! 7,8. 7 7 & ; < & & 7: 1 , = = - 1 ! & & = = .
PAGE 25
MCP2003/4/3A/4A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2010-2013 Microchip Technology Inc.
PAGE 26
MCP2003/4/3A/4A Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002230E-page 26  2010-2013 Microchip Technology Inc.
PAGE 27
MCP2003/4/3A/4A ! "" #$ %& ! ' 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4  2010-2013 Microchip Technology Inc.
PAGE 28
MCP2003/4/3A/4A NOTES: DS20002230E-page 28  2010-2013 Microchip Technology Inc.
PAGE 29
MCP2003/4/3A/4A APPENDIX A: REVISION HISTORY Revision E (October 2013) The following is the list of modifications: 1. 2. 3. Added additional specification for IHVREN in Section 2.3 “DC Specifications”. Clarified wake-up on LBUS functionality. Added RXD monitoring description. Revision D (December 2011) The following is the list of modifications: 4. 5. Added the MCP2003A and MCP2004A devices and related information throughout the document. Updated Figures 1.2, 1.3, 1.4, 1.5, 2.6, 2.7.
PAGE 30
MCP2003/4/3A/4A NOTES: DS20002230E-page 30  2010-2013 Microchip Technology Inc.
PAGE 31
MCP2003/4/3A/4A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
PAGE 32
MCP2003/4/3A/4A NOTES: DS20002230E-page 32  2010-2013 Microchip Technology Inc.
PAGE 33
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 34
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