Datasheet
MCP19111
DS22331A-page 14 2013 Microchip Technology Inc.
2.1.23 PHASE PIN
The PHASE pin provides the return path for the high-
side gate driver. The source of the high-side MOSFET,
drain of the low-side MOSFET and the inductor are
connected to this pin.
2.1.24 BOOT PIN
The BOOT pin is the floating bootstrap supply pin for
the high-side gate driver. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side MOSFET.
2.1.25 +V
SEN
PIN
The non-inverting input of the unity gain amplifier used
for output voltage remote sensing is connected to the
+V
SEN
pin. This pin can be internally pulled-up to V
DD
by setting PE1<PUEN> bit.
2.1.26 -V
SEN
PIN
The inverting input of the unity gain amplifier used for
output voltage remote sensing is connected to the
-V
SEN
pin. This pin can be internally pull-down to GND
by setting PE1<PDEN> bit.
2.1.27 +I
SEN
PIN
The non-inverting input of the current sense amplifier is
connected to the +I
SEN
pin.
2.1.28 -I
SEN
PIN
The inverting input of the current sense amplifier is
connected to the -I
SEN
pin.
2.1.29 EXPOSED PAD (EP)
There is no internal connection to the Exposed Thermal
Pad. The EP should be connected to the GND pin and
to the GND PCB plane to aid in the removal of the heat.