Datasheet

MCP1825/MCP1825S
DS22056B-page 26 © 2008 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 3
Lead Pitch e 2.30 BSC
Outside Lead Pitch e1 4.60 BSC
Overall Height A – – 1.80
Standoff A1 0.02 – 0.10
Molded Package Height A2 1.50 1.60 1.70
Overall Width E 6.70 7.00 7.30
Molded Package Width E1 3.30 3.50 3.70
Overall Length D 6.30 6.50 6.70
Lead Thickness c 0.23 0.30 0.35
Lead Width b 0.60 0.76 0.84
Tab Lead Width b2 2.90 3.00 3.10
Foot Length L 0.75 – –
Lead Angle φ 0° – 10°
D
b2
EE1
1
2
3
e
e1
A
A2
A1
b
c
L
φ
Microchip Technology Drawing C04-032B